Webinar: How to Nail Your HDI PCB Routing
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July 15th, 2026 | 9am PT
COST: FREE
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14
Days
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23
Hours
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40
Minutes
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44
Seconds
Vandana CC
Engineering Project Coordinator at Sierra Circuits
This webinar will be hosted on Zoom.
Following this event, you will receive:
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Slides
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Recording
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Tools & calculators
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Design guides
Webinar abstract:
HDI technology allows you to route complex designs, but it also introduces new challenges. A design that appears perfect in the CAD tool can often become difficult to fabricate if HDI constraints are not considered early in the design cycle. Decisions such as microvia selection, BGA breakout strategy, and layer transitions can determine whether a design moves smoothly into production or requires multiple design iterations.
In this webinar, you will learn practical techniques for HDI PCB routing that can help you achieve a successful prototype.
How to route high-density circuit boards without compromising reliability
To begin with, dense designs rely heavily on microvias to access multiple routing layers within a limited board area. Choose the appropriate microvia structure, either stacked or staggered, based on your layer transitions, impedance, and routing density needs.
To enhance reliability, avoid high microvia aspect ratios, which complicate drilling and plating processes. The recommended aspect ratio is ≤0.8:1. Minimize the use of multiple stacked microvias on sensitive high-speed signals. Maintain consistent differential-pair spacing and keep critical signals on the same layer to ensure optimum signal integrity.
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Beyond microvia implementation, successfully escaping fine-pitch BGAs is a critical aspect of HDI routing. As package pitches continue to shrink, traditional fanout methods become difficult to implement. Conventional through-hole vias may work for 0.8 mm pitch devices, but microvias are required for 0.5 mm pitch BGAs and smaller. You can opt for via-in-pad structures where microvias are to be placed directly within BGA pads. Avoid excessive via usage beneath large packages, as it might increase fabrication complexity.
Maintaining controlled impedance becomes challenging as routing density increases. High-speed interfaces are particularly sensitive to impedance discontinuities. Avoid abrupt trace-width changes, excessive neck-down regions, and unnecessary layer transitions. Since HDI structures typically use thin dielectrics, even small variations in dielectric thickness can significantly affect impedance. Work closely with your fabricator to define dielectric thicknesses that support your impedance requirements. Avoid placing components or vias between differential pairs, as these discontinuities might cause signal reflections.
If you are designing high-density circuits for applications such as AI accelerators, medical devices, aerospace systems, or advanced consumer electronics, this session is specifically for you.
Webinar agenda:
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HDI design tradeoffs: density vs manufacturability
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Best practices for microvia routing
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Escape routing for fine-pitch BGAs
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Managing impedance in dense HDI routing
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Component placement guidelines
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DFM checks that every designer should perform
About Vandana CC
With a strong foundation in physics, Vandana CC brings a deep technical understanding to her work in PCB design and electronics manufacturing. She holds a Master’s in Physics and has experience teaching before transitioning into research at the Indian Institute of Science.
At Sierra Circuits, Vandana has played a key role in R&D projects, contributing to the development of engineering tools and calculators, technical content creation, and customer demos. Currently, she focuses on project coordination, ensuring seamless collaboration both within the team and with external partners. Her expertise bridges the gap between technical innovation and practical application, making her an integral part of Sierra Circuits’ engineering efforts.
