Webinar: Aerospace PCB Design Challenges and Techniques to Fix Them
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June 24th, 2026 | 9 AM PT
COST: FREE
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11
Days
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13
Hours
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41
Minutes
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24
Seconds
Vandana CC
Engineering Project Coordinator at Sierra Circuits
This webinar will be hosted on Zoom.
Following this event, you will receive:
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Slides
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Recording
Webinar abstract:
As organizations like NASA, SpaceX, and Blue Origin continue to advance space exploration, the demand for highly reliable electronics continues to grow. The success of a satellite, avionics platform, or radar system depends on printed circuit boards that can survive extreme operating conditions.
With the guidance of PCB experts, we have put together a webinar that explains the common aerospace circuit design challenges and proven strategies to build mission-critical systems.
Building aerospace PCBs that survive extreme conditions
EMI is a common cause of signal degradation in aerospace electronics. It can originate from switching power supplies, RF transmitters, digital clocks, and high-speed data lines. As edge rates increase, unwanted emissions can couple into adjacent circuitry, disrupting signal transmission.
To manage EM radiation, start with a well-designed stack-up. Use continuous ground planes with low-impedance return paths to confine electromagnetic fields within the circuit. Separate noisy digital circuits from sensitive analog and RF sections. When additional protection is required, employ shielding techniques such as grounded metal enclosures.
Controlled impedance routing is equally important. Route high-speed and RF traces with consistent geometries to minimize signal reflections and impedance discontinuities. Limit unnecessary via transitions to reduce insertion loss.
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Thermal stress is another leading cause of reliability failures in aerospace electronics. Rapid thermal cycling, combined with heat generated by FPGAs, RF amplifiers, and power converters, might result in solder joint fatigue, barrel cracking, and component degradation.
Improving thermal reliability begins with laminate selection. Choose substrates with low Z-axis CTE (<70 ppm/°C) and high glass transition temperatures (Tg >180°C) to withstand repeated thermal excursions. When designing layouts, use heavy copper structures and dense thermal via arrays to minimize localized hot spots.
Mechanical failures often originate from continuous vibration, shock, and acceleration forces encountered during takeoff, landing, and flight operations. These stresses can lead to cracked solder joints and component fatigue over time.
To improve mechanical robustness, use vibration-resistant press-fit connectors. Avoid placing heavy components near board edges to ensure structural integrity.
If you’re developing avionics, communication systems, or radar electronics, this session is tailored for you. Join us to learn practical techniques for overcoming common aerospace PCB design challenges and building reliable mission-critical systems.
Webinar agenda:
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How are aerospace PCBs different from commercial electronics?
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3 critical challenges aerospace designers must know:
- o 1. EMI and undesired radiation
- Sources of EMI
- Controlled impedance routing and grounding strategies for EMC
- o 2. Extreme temperature variations during operation
- Typical hotspots that cause heat build-up
- Layout techniques to improve thermal reliability
- o 3. Vibration and mechanical stress
- Common mechanical failure points in PCB assemblies
- Component placement strategies to boost mechanical robustness
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Aerospace industry standards and qualification requirements
Vandana CC, Sierra Circuits
With a strong foundation in physics, Vandana CC brings a deep technical understanding to her work in PCB design and electronics manufacturing. She holds a Master’s in Physics and has experience teaching before transitioning into research at the Indian Institute of Science.
At Sierra Circuits, Vandana has played a key role in R&D projects, contributing to the development of engineering tools and calculators, technical content creation, and customer demos. Currently, she focuses on project coordination, ensuring seamless collaboration both within the team and with external partners. Her expertise bridges the gap between technical innovation and practical application, making her an integral part of Sierra Circuits’ engineering efforts.
