Speciality PCBs
Sierra Circuits is increasingly the Research & Development destination of choice for many Printed Circuit Board (PCB) designers.
We have worked with many Fortune 1000 companies in their cutting-edge Research Projects, developing very High-technology PCBs, Metal Core PCBs, Multilayer PCBs and Microelectronics PCBs. As part of R&D projects, we can also develop special processes for our customers.
Pricing is on a per-project basis.

For more information on R&D projects, please contact:
Amit Bahl
Some recent projects include:
Microelectronics Boards Heavey Copper Boards
Aluminum Metal Core Boards Copper Metal Core Boards
Special Material Boards Special Construction Boards
Blind & Buried Vias Conductive Epoxy Filled Vias


Product Features Standard Advanced Micro Electronics
PC Board Attributes
Min Layer count 1 1 1
Max Layer Count2426+26+
Min Board Thickness.010".004".004"
Max Board Thickness.200".200" +.200" +
Min Core Thickness.002".002".002"
Min Dielectric.002".001".001"
Min. Starting Copper Foil Weight9 micron3 micron3 micron
Max. Finished Copper Thickness (O/L)6 oz> 6 oz.0015"
Max. Finished Copper Thickness (I/L)4 oz> 4 oz.001"
Maximum Panel Size21" x 29"21" x 29"12" x 18"
Minimum Panel Size12" x 18"12" x 18"8" x 8"
Smallest Mech Drill Diameter.0059".004".004"
Smallest Laser Drill Diameter.0030" / .0080".0025" / .0100".0025" / .0100"
Min Finished Hole Size.004".002"Plated shut
Max Thru Hole Aspect Ratio10:116:116:1
Max Blind Via Aspect Ratio.75:11.2:1.8:1
Blind Via Finished Hole Size.004"Plated shutPlated shut
Buried Via Finished Hole Size.004".002".002"
Minimum Line Width (trace) and Spacing.003".002".00125"
Min Pad Size for test.005".003".003"
Process Pad DiameterD + .012" (1 mil annular ring)D + .010" (Tangency)D + .006"
Stacked viasYesYesYes
Minimum Wire Bond Pad size> .006".004"0.0025"
Controlled Impedance Tolerance10%5%5%
Solder Mask Registration.002"<.002".002"
Solder Mask Feature Tolerance.001".001".001"
Solder Mask Min Dam Size.004".002".002"
Min. Diameter Rout Cutter Available.024".021".021"
Routed Part Size Tolerance.010"<.010"<.010"
Laser hole location Tolerance.0005".0005".0005"
Laser Routed Part Size Tolerance - can only be done with panels <.032" thick.001".001".001"
Bow & Twist Tolerance7%<7%<7%
Thickness Tolerance10%< 10%< 10%
Sequential Lam2 or less lam cycles> 3 lam cycles> 3 lam cycles
Buried Vias2 or less> 3> 3
Blind ViasYesYesYes
Conductive Filled ViasYesYesYes - Cu plate shut
Non Conductive Filled ViasYesYesYes
Surface Finishes
HASL (Vertical or Horizontal)YesYesNo
Lead Free HASLYesYesNo
OSP (Shikoku F2)YesYesYes
OSP (Entek)YesYesYes
ENIG (Electroless Nickel/Immersion Gold)YesYesYes
ENEPIG (Electroless Nickel-Electroless Paladium-Immersion Gold) Yes Yes Yes
Immersion SilverYesYesYes
Tin NickelYesYesNo
Electrolytic Soft GoldYesYesYes
Electrolytic Hard GoldYesYesYes
Selective GoldYesYesYes
Solder Masks
Semi - Gloss GreenYesYesYes
Gloss GreenYesYesYes
Matte - GreenYesYesYes
All colorsYesYesYes
Routed ArrayYesYesYes
V Score, Edge to Copper0.01"0.007"0.007"
V Score Angles35°,45°,60°35°,45°,60°35°,45°,60°
Milling+/- .003"+/- .003"+/- .001"
Edge CastellationYesYesYes
Edge PlatingYesYesYes
Electrical Test
10 VoltYesYesYes
40 Volt (Burn in bds)YesYesYes
250 VoltNoYesYes
500 VoltNoYesYes
Hi PotNoYesNo
Laminate Materials
Very Thin FilmNoYesYes
Arlon 85NTYesYesNo
Hybrid ConstructionsYesYesYes
Isola FR406YesYesYes
Isola FR408YesYesYes
Isola IS410YesYesYes
Isola IS620NoYesNo
Isola P95YesYesYes
Isola P96YesYesYes
Matsushita R1766YesYesYes
Matsushita R1755YesYesNo
Matsushita MegtronYesYesNo
Nelco N4000-13 (SI)YesYesYes
Nelco N4000-6 FCYesYesYes
Nelco N4000-29YesYesNo
Neltec N7000-2YesYesYes
No Flow Pre PregYesYesYes
Polyclad PCL370HRYesYesYes
Polyclad GetekYesYesYes
PSA Bond FilmNoYesYes
Rogers 3000YesYesNo
Rogers R4003YesYesNo
Rogers R4350YesYesNo
Rogers 5880YesYesNo
Rogers 6000YesYesNo
Rogers TMMYesYesNo
Available Reports
X-ray FluorescenceYesYesYes
Ionic ContaminationYesYesYes
Time Domain Reflectometry test (TDR)YesYesYes
Certificate of Compliance (C of C)YesYesYes
PCB Classifications
Military MILSPEC 55-110YesYesNo
IPC 6012, Class 1, 2 & 3YesYesYes
ISO 9001:2015YesYesYes
ISO 13485:2016YesYesYes
PCB Capabilities By Market:
1.High Reliability PC Boards
  -Up to 2000 Thermal cycles
  -For PC Boards that must not fail
2.Burn-in Boards
  -14 Layers - .062" thick
  -.5 mm pitch
  -Step-down connectors
  -Special materials
  -Large sizes up to 24" x 28"
  -High Reliability
3.High Technology Boards
  -Microelectronics (Line and Space down to .00125"/.00125")
[learn more]
  -Differential Impedance
  -Up to 30 Layers
  -Lead Free process
  -Special materials
  -Sequential lamination
  -Blind and buried vias
  -Laser Drill
  -Filled vias
  -Via in pads
  -Metal core
  -Carbon paste
  -Plated edges
  -Plated edge holes
  -Heavy Copper
  -Selective Finishes
4.Standard Technology Boards
  -1 to 10 Layers
  -Trace/Space 5/5
  -Same day for 2 Layers
  -24 hours to 10 Days for multilayers
  -Lead Free process
  -All standard materials

PCB Capabilities By Process:

Front-end CAM
-Fully automated Tooling System
Imaging-Laser Direct Imaging
-Trace/Space 2/2
Multilayer Lamination
-Up to 30 Layers
-Sequential lamination
-Automated registration
-.006" Mechanical Drill
-Laser Drill down to 2 mils (.002")
-Trace/Space 2/2 mils
-Aspect ratio 10+
-LPI, Dry Film
-5 mil lines
-Route and retain
Electrical Test
-.5mm pitch, Flying probe and High Density grid
Quality and Production Control Information System
-Lead Free FR-4
-Rogers 4003 & 4350
-Most other materials
To get a quote submit your gerber files to www.protoexpress.com/customquote