| Custom-made boards include, but not limited to the following: |
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Aluminum Metal Core Boards |
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Copper Metal Core Boards |
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Special Material Boards |
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Special Construction Boards |
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Blind & Buried Vias |
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Conductive Epoxy Filled Vias |
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Technology can be described as follows:
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Materials
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FR4
Polyimide
Getek
Thermount
Arlon
Rogers 4050, 4003 |
| Pitch |
Min .5 mm |
| SMT and Through Hole |
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| HASL Boards |
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Imaging |
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Min Line/Space |
.003"/.003" |
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Surface Mount Pad |
.008" |
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Layer to Layer Reg |
+.002" |
| Lamination |
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Max Layers |
30 |
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Min/Max Thickness |
.002"/.280" |
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Overall Thickness |
+- 8% |
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Bow & Twist |
.7% |
| Drill and
Routing |
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Hole Location |
.004" DTP |
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Finished Hole Size |
.006" |
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Tolerance (PTH) |
+-.003" |
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Tolerance (NPTH) |
+-.001" |
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Min Drill Size |
.006" |
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Aspect Ratio |
20:1 |
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Min Pad to Hole (I/L) |
FHS + .010" |
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Min Plane Relief |
FHS + .025" |
| Plating |
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Electroless Ni |
100 micro inches |
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Immersion Au |
3 - 5 micro inches |
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Copper |
.003" |
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Nickel |
.0003 - .0005" |
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Solder |
.0001-.001" |
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Max Gold |
50 - 100 micro inches |
| Etch
Factors |
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Inner Layer |
+ .0005" |
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Outer Layer |
+ .0005" |
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Controlled Imp |
+ 10% (Tighter tolerances down to 5% may be allowed on a per job basis with
additional charges)
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| Solder
Mask |
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Minimum Clearance |
.002" /side |
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Minimum Lay Down |
.002" |
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Color |
Most colors available |
| Nomenclature |
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Minimum Line |
.005 inches |
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Color |
White (Other colors available on request) |
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