| High Density Interconnect (HDI) Boards |
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Sierra Circuits has specialized in HDI boards since 1998, and has mature processes for multiple laminations, blind/buried vias, fine pitch,build-up
technology and via-in-pad technology. With increasing complexity of applications and form-factor considerations, our customers are rapidly turning to HDI technology for
their cutting-edge products.
Our HDI customers include companies such as Cisco, Dell, and NASA.
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Benefits of High Density Interconnect (HDI) technology
- Be able to route tight pitch, high pin-count, BGAs, FPGAs
- Reduce layer counts by up to 50% (Example: from 30 layers to 12 layers)
- Reduce weight and size of your PCB with High Density Interconnect Technology
- Better High Speed Signal Integrity
- Benefit from High Reliability
Sierra Circuits' Capabilities in HDI technology
- Fine pitch imaging
- Tightly controlled etching capability
- Tight layer to layer registration
- Sequential Lamination
- Build-up Technology
- Via-in-Pad
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HDI Design Guidelines
Sign-up for an online webinar on Design Guidelines for High Density
Interconnect Manufacturing.
Please contact Amit Bahl amit@protoexpress.com |
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High Density Interconnect Constructions
- Via in pad, Filled vias
- Plated thorough hole (PTH) is filled by epoxy resin and plated by cu as lid
- Via in Pad structure can save surface area for wiring enabling the PTH pad to mount to SMT becomes to be able to mount SMT devices
- Discrete capacitor can be reduced inductance for connection
- Minimum PTH diameter is 0.15mm, aspect ratio can be 10
- Staggered vias
- Hole fill is not a requirement
- Stacked vias
- Hole fill required
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| An example of a complex Blind-via /Sequential Buildup design.
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| Our capabilities include but not limited to the following: |
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3/3 is available in one oz copper as a commercial product. |
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2/2 will be available for special high technology projects.
With engineering approval in ˝ oz copper. |
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Any laminate can be produced with 3/3 |
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Any thickness of inner layer is available in 3/3 |
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Our 3/3 and 2/2 technology produces a line with almost no under cut. |
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Our 3/3 and 2/2 lines are much stronger then most other companies because of the lack of under cut. |
