| Layer Count: |
|
|
Up to 12 layers |
.062" thickness |
|
Up to 14 layers |
.067" thickness |
|
Up to 16 layers |
.093" thickness |
Board
Size
|
12" x 24" and smaller
19" x 23"
23" x 27" |
Materials
|
Nelco 4000-13
Polyimide 55ST
Thermount 55 ST, 85 MT
BT |
| Pitch |
Min .5 mm |
| SMT and Through Hole |
|
| HASL Boards |
|
|
Imaging |
|
|
Min Line/Space |
.003/.003 |
|
Surface Mt Pad |
.008 |
|
Layer to Layer Reg |
+-.002 |
| Lamination |
|
|
Max Layers |
30 |
|
Min/Max Thickness |
.002/.280 |
|
Overall Thickness |
+- 8% |
|
Bow & Twist |
.7% |
| Drill and
Routing |
|
|
Hole Location |
.004 |
|
Finished Hole Size |
.006 |
|
Tolerance (PTH) |
+-.001 inches |
|
Tolerance (NPTH) |
+-.001 inches |
|
Min Drill Size |
.006 |
|
Aspect Ratio |
20:1 |
|
Min Pad to Hole (I/L) |
Finished Hole Size + .010 inches |
|
Min Plane Relief |
Finished Hole Size + .025 inches |
| Plating |
|
|
Electroless Ni |
100 micro inches |
|
Immersion Au |
3 - 5 micro inches |
|
Copper |
.003 inches |
|
Nickel |
.0003 - .0005 inches |
|
Solder |
.0001-.001 inches |
|
Max Gold |
50 - 100 micro inches |
| Etch
Factors |
|
|
Inner Layer |
+ .0005 inches |
|
Outer Layer |
+ .0005 inches |
|
Controlled Imp |
+-5% |
| Solder
Mask |
|
|
Min Clearance |
.002 /side |
|
Min Lay Down |
.002 inches |
|
Color |
Most colors available |
| Nomenclature/Legend |
|
|
Min Line |
.005 inches |
|
Color |
White (other colors available on request) |
