stdClass Object ( [posts] => Array ( [0] => stdClass Object ( [id] => 1770 [name] => Lucy Iantosca [username] => lucy.sierracircuits [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/{size}/8_2.png [created_at] => 2023-12-27T17:53:08.923Z [like_count] => 0 [blurb] => What you will learn: HDI definitions, types and markets: Not all HDI products are the SAME! History of HDI: It helps to understand why HDI was developed in 1982 HDI fabricati... [post_number] => 1 [topic_id] => 748 ) [1] => stdClass Object ( [id] => 3496 [name] => Lucy Iantosca [username] => lucy.sierracircuits [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/{size}/8_2.png [created_at] => 2024-04-25T18:38:38.699Z [like_count] => 0 [blurb] => Thank you for your interest in our webinar on using HDI to improve SI/PI by @happy2holden . If you've filled out the form on our registration page, you are registered and will receive an email confirmation... [post_number] => 1 [topic_id] => 1368 ) [2] => stdClass Object ( [id] => 2675 [name] => Lucy Iantosca [username] => lucy.sierracircuits [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/{size}/8_2.png [created_at] => 2024-02-15T23:06:49.345Z [like_count] => 0 [blurb] => The recording link is below. [post_number] => 1 [topic_id] => 1104 ) [3] => stdClass Object ( [id] => 2058 [name] => Poulomi [username] => PoulomiG [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/poulomig/{size}/288_2.png [created_at] => 2024-01-12T13:58:53.141Z [like_count] => 1 [blurb] => ...ing a 1:1 solder mask expansion and paste mask ensures an optimum soldering process. It allows sufficient room for component placement, especially in HDI designs. [post_number] => 3 [topic_id] => 822 ) [4] => stdClass Object ( [id] => 420 [name] => Atar Mittal [username] => atar.mittal [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/atar.mittal/{size}/49_2.png [created_at] => 2023-10-24T00:25:25.827Z [like_count] => 0 [blurb] => The success of high-density designs heavily relies on the careful selection of appropriate HDI PCB materials that can considerably impact signal integrity, thermal management, and the overall performance of your design. Consider these factors w... [post_number] => 1 [topic_id] => 264 ) [5] => stdClass Object ( [id] => 424 [name] => Pooja Mitra [username] => Pooja_Mitra [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/p/ce73a5/{size}.png [created_at] => 2023-10-25T11:29:50.531Z [like_count] => 0 [blurb] => Originally published at: https://www.protoexpress.com/blog/high-speed-hdi-pcb-design-strategies/ Syed Ubaid Ali Warsi, the owner of Wavetroniks, provided his insights into high-speed and HDI PCB design strategies at PCB Wes... [post_number] => 1 [topic_id] => 267 ) [6] => stdClass Object ( [id] => 145 [name] => Lucy Iantosca [username] => lucy.sierracircuits [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/{size}/8_2.png [created_at] => 2023-09-26T17:02:04.555Z [like_count] => 0 [blurb] => What are your biggest challenges when routing HDI boards? [post_number] => 1 [topic_id] => 139 ) [7] => stdClass Object ( [id] => 2047 [name] => Pooja Mitra [username] => Pooja_Mitra [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/p/ce73a5/{size}.png [created_at] => 2024-01-11T14:09:01.674Z [like_count] => 0 [blurb] => Originally published at: https://www.protoexpress.com/blog/hdi-pcb-routing-challenges/ HDI designs pose complex routing challenges due to their tight spacing between components and traces. The use of DRC settings... [post_number] => 1 [topic_id] => 857 ) [8] => stdClass Object ( [id] => 3024 [name] => Poulomi [username] => PoulomiG [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/poulomig/{size}/288_2.png [created_at] => 2024-03-18T20:27:51.651Z [like_count] => 0 [blurb] => Originally published at: https://www.protoexpress.com/blog/case-study-designing-hdi-board-with-4-and-65-mm-bgas/ BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, excellent thermal co... [post_number] => 1 [topic_id] => 1226 ) [9] => stdClass Object ( [id] => 2016 [name] => Henry [username] => Henry [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/h/df705f/{size}.png [created_at] => 2024-01-10T14:12:35.712Z [like_count] => 0 [blurb] => What is the ideal component clearance for an HDI board operating at 150 V? [post_number] => 1 [topic_id] => 846 ) [10] => stdClass Object ( [id] => 2046 [name] => Mark A [username] => mark [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/m/e9c0ed/{size}.png [created_at] => 2024-01-11T13:21:44.322Z [like_count] => 0 [blurb] => How does the increased component density on HDI PCBs impact the routing process, especially for complex designs? [post_number] => 1 [topic_id] => 856 ) [11] => stdClass Object ( [id] => 379 [name] => Pooja Mitra [username] => Pooja_Mitra [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/p/ce73a5/{size}.png [created_at] => 2023-10-17T13:02:41.935Z [like_count] => 0 [blurb] => Originally published at: https://www.protoexpress.com/blog/hdi-pcb-design-tips-for-signal-integrity/ When it comes to designing HDI PCBs, a plethora of challenges await, including complex routing requirements, is... [post_number] => 1 [topic_id] => 248 ) [12] => stdClass Object ( [id] => 1771 [name] => Lucy Iantosca [username] => lucy.sierracircuits [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/{size}/8_2.png [created_at] => 2023-12-27T21:25:06.929Z [like_count] => 0 [blurb] => Start posting your HDI questions now and Happy will answer on January 3rd! [post_number] => 1 [topic_id] => 749 ) [13] => stdClass Object ( [id] => 3826 [name] => Tim [username] => timothy.phillips [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/t/d78d45/{size}.png [created_at] => 2024-05-30T19:12:09.394Z [like_count] => 2 [blurb] => Many 0.5mm BGA pitch packages force you into HDI connection methods and vias will need likely some variation of buried/blind/via-in-pad via types. The via geometries that you called out are for less... [post_number] => 7 [topic_id] => 1467 ) [14] => stdClass Object ( [id] => 3626 [name] => Kevin [username] => kevin.fowler [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/k/8baadc/{size}.png [created_at] => 2024-05-10T15:46:11.902Z [like_count] => 1 [blurb] => I use I-Tera MT40 cores on the outside on current designs. I will need to use fine pitch BGAs soon. What prepregs would you suggest to use for a HDI combined RF and digital design? [post_number] => 4 [topic_id] => 1394 ) [15] => stdClass Object ( [id] => 3134 [name] => Mark [username] => mjhughes [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/mjhughes/{size}/294_2.png [created_at] => 2024-03-27T04:40:03.589Z [like_count] => 1 [blurb] => ...I had in mind that the gentlemen who needed a fine-pitch heavy copper board, and my inclination was to perhaps separate the design into a small thin HDI + a separate heavy copper board as a possible solution. Every design you submit to a fab house needs a certain number of steps to complete, and there... [post_number] => 26 [topic_id] => 1238 ) [16] => stdClass Object ( [id] => 3101 [name] => Tim [username] => timothy.phillips [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/t/d78d45/{size}.png [created_at] => 2024-03-25T21:48:02.582Z [like_count] => 1 [blurb] => A conventional 8 layer stackup without advanced construction (like buried vias or HDI) will normally have 3 cores with 4 prepreg layers alternating between the cores. An alternate 8 layer structure is to use 4 cores with 3 prepreg laye... [post_number] => 5 [topic_id] => 1230 ) [17] => stdClass Object ( [id] => 3016 [name] => Tim [username] => Ehrlichmann17 [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/e/34f0e0/{size}.png [created_at] => 2024-03-18T17:01:11.412Z [like_count] => 1 [blurb] => Which termination methods do you consider most efficient for managing high-speed signals in HDI PCBs, and how do you determine the suitable termination technique? [post_number] => 4 [topic_id] => 1210 ) [18] => stdClass Object ( [id] => 2347 [name] => Ethan [username] => ethanpierce [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/e/d78d45/{size}.png [created_at] => 2024-02-01T04:11:41.236Z [like_count] => 1 [blurb] => ...s, focusing on compactness, energy efficiency, connectivity, and durability. Key aspects include: Compact Size : Utilizing high-density interconnect (HDI) technology to fit into small spaces. Low Power Consumption : Optimizing layout for energy efficiency and incorporating low-power components. Connect... [post_number] => 11 [topic_id] => 835 ) [19] => stdClass Object ( [id] => 2835 [name] => Lucy Iantosca [username] => lucy.sierracircuits [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/{size}/8_2.png [created_at] => 2024-02-27T18:25:33.884Z [like_count] => 0 [blurb] => Originally published at: https://www.protoexpress.com/blog/component-placement-guidelines-pcb-design-assembly/ In the era of miniaturization and HDI PCBs, space optimization on the PCB might frequently affect proper component placement. Appropriate component placement on a PCB improves the signal... [post_number] => 1 [topic_id] => 1164 ) [20] => stdClass Object ( [id] => 1889 [name] => Mark A [username] => mark [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/m/e9c0ed/{size}.png [created_at] => 2024-01-03T14:20:59.071Z [like_count] => 0 [blurb] => I am designing an HDI board with a 2V operating voltage. Does the recommended 1.6 mil clearance between the solder mask and pads apply here? [post_number] => 2 [topic_id] => 205 ) [21] => stdClass Object ( [id] => 1643 [name] => Michael [username] => michael.gay [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/michael.gay/{size}/158_2.png [created_at] => 2023-12-12T22:42:17.429Z [like_count] => 1 [blurb] => ...down. You also need to consider the PCB design and PCB processing costs which will effect the BOM cost adder for the higher performance copper foil. HDI structures with multiple relamination cycles increase the cost of the PCB. It is also important to note that the foil is provided by the fabricator a... [post_number] => 13 [topic_id] => 662 ) [22] => stdClass Object ( [id] => 1374 [name] => Sajal [username] => Sajal_ee [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/s/d26b3c/{size}.png [created_at] => 2023-11-30T09:28:16.147Z [like_count] => 0 [blurb] => I was reading an e-book in HDI design and found that Panasonic Megtron is not mentioned in the list. Please indicate which material in the list is representing Megtron 4 or Megtron... [post_number] => 1 [topic_id] => 631 ) [23] => stdClass Object ( [id] => 1051 [name] => Michael Owen [username] => Michael_Owen [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/m/977dab/{size}.png [created_at] => 2023-11-21T04:57:26.313Z [like_count] => 0 [blurb] => Can you send the same design files you used for your prototype boards for high-volume fab? (taking HDI with 2 sequential lam. and microvias) [post_number] => 2 [topic_id] => 485 ) [24] => stdClass Object ( [id] => 931 [name] => Madison [username] => Madison [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/m/db5fbb/{size}.png [created_at] => 2023-11-15T08:19:32.446Z [like_count] => 0 [blurb] => Hi Paul, How do the operating frequency and signal loss of a PCB design affect the choice of HDI material? [post_number] => 8 [topic_id] => 308 ) [25] => stdClass Object ( [id] => 794 [name] => Travis [username] => travis [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/t/bbce88/{size}.png [created_at] => 2023-11-08T15:56:23.419Z [like_count] => 0 [blurb] => Are there any specific ground plane and return path considerations when you're modeling a HDI circuit board operating at high frequencies? [post_number] => 11 [topic_id] => 290 ) [26] => stdClass Object ( [id] => 483 [name] => Pooja Mitra [username] => Pooja_Mitra [avatar_template] => https://avatars.discourse-cdn.com/v4/letter/p/ce73a5/{size}.png [created_at] => 2023-10-30T15:34:36.053Z [like_count] => 0 [blurb] => ...fillers or polyamide for base material. Vertical machines, equipped with magnetic clamps, facilitate easy transport of panels as thin as 25 microns. HDI mSAP approach achieves an impressive line spacing of just 7 microns. Watch the… [post_number] => 1 [topic_id] => 278 ) [27] => stdClass Object ( [id] => 34 [name] => Lucy Iantosca [username] => lucy.sierracircuits [avatar_template] => /user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/{size}/8_2.png [created_at] => 2023-09-05T22:24:42.809Z [like_count] => 0 [blurb] => ...-and-rigid-flex/26 Flex and rigid-flex https://sierraconnect.protoexpress.com/c/manufacturing/high-density-interconnect/27 High-density interconnect (HDI) https://sierraconnect.protoexpress.com/c/manufacturing/microelectronics/28 Microelectronics https://sierraconnect.protoexpress.com/c/manufacturing/t... [post_number] => 1 [topic_id] => 31 ) ) [topics] => Array ( [0] => stdClass Object ( [id] => 748 [title] => HDI Fabrication Problems, Quality Control and Reliability Issues by Happy Holden [fancy_title] => HDI Fabrication Problems, Quality Control and Reliability Issues by Happy Holden [slug] => hdi-fabrication-problems-quality-control-and-reliability-issues-by-happy-holden [posts_count] => 4 [reply_count] => 2 [highest_post_number] => 4 [created_at] => 2023-12-27T17:53:08.838Z [last_posted_at] => 2024-01-10T04:27:23.494Z [bumped] => 1 [bumped_at] => 2024-01-10T04:27:23.494Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => What you will learn: HDI definitions, types and markets: Not all HDI products are the SAME! History of HDI: It helps to understand why HDI was developed in 1982 HDI fabrication problems and issues: Some of the hurdles … [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => webinar [1] => hdi [2] => happy-holden ) [tags_descriptions] => stdClass Object ( ) [category_id] => 71 [has_accepted_answer] => ) [1] => stdClass Object ( [id] => 1368 [title] => Webinar: Using HDI to Improve Signal Integrity and Power Integrity Performance [fancy_title] => Webinar: Using HDI to Improve Signal Integrity and Power Integrity Performance [slug] => webinar-using-hdi-to-improve-signal-integrity-and-power-integrity-performance [posts_count] => 11 [reply_count] => 9 [highest_post_number] => 11 [created_at] => 2024-04-25T18:38:38.612Z [last_posted_at] => 2024-05-15T20:13:25.403Z [bumped] => 1 [bumped_at] => 2024-05-15T20:13:25.403Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Thank you for your interest in our webinar on using HDI to improve SI/PI by @happy2holden. If you’ve filled out the form on our registration page, you are registered and will receive an email confirmation within 5 minut… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => signal-integrity [1] => hdi [2] => power-integrity [3] => happy-holden ) [tags_descriptions] => stdClass Object ( ) [category_id] => 71 [has_accepted_answer] => ) [2] => stdClass Object ( [id] => 1104 [title] => New HDI BGA Breakouts and Routing Strategies [fancy_title] => New HDI BGA Breakouts and Routing Strategies [slug] => new-hdi-bga-breakouts-and-routing-strategies [posts_count] => 2 [reply_count] => 0 [highest_post_number] => 2 [created_at] => 2024-02-15T23:06:49.274Z [last_posted_at] => 2024-03-20T21:50:50.310Z [bumped] => 1 [bumped_at] => 2024-03-20T21:50:50.310Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => The recording link is below. [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => bga [1] => routing [2] => hdi ) [tags_descriptions] => stdClass Object ( ) [category_id] => 71 [has_accepted_answer] => ) [3] => stdClass Object ( [id] => 822 [title] => DFA Essentials a PCB Designer Should Know [fancy_title] => DFA Essentials a PCB Designer Should Know [slug] => dfa-essentials-a-pcb-designer-should-know [posts_count] => 18 [reply_count] => 9 [highest_post_number] => 18 [created_at] => 2024-01-05T22:07:03.244Z [last_posted_at] => 2024-01-25T13:44:24.025Z [bumped] => 1 [bumped_at] => 2024-01-25T13:44:24.025Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Agenda: Common design for assembly mistakes Best practices for a flawless design file Component placement strategies Thermal management considerations DFA tips for solder mask and silkscreen DFA rules for comprehensive… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => webinar [1] => pcba [2] => pcb-assembly [3] => dfa [4] => assembly ) [tags_descriptions] => stdClass Object ( ) [category_id] => 71 [has_accepted_answer] => ) [4] => stdClass Object ( [id] => 264 [title] => TIP: Choosing materials for HDI boards [fancy_title] => TIP: Choosing materials for HDI boards [slug] => tip-choosing-materials-for-hdi-boards [posts_count] => 1 [reply_count] => 0 [highest_post_number] => 1 [created_at] => 2023-10-24T00:25:25.755Z [last_posted_at] => 2023-10-24T00:25:25.827Z [bumped] => 1 [bumped_at] => 2023-10-24T00:25:25.827Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => The success of high-density designs heavily relies on the careful selection of appropriate HDI PCB materials that can considerably impact signal integrity, thermal management, and the overall performance of your design. … [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => signal-integrity [1] => pcb-materials [2] => hdi [3] => dielectric [4] => hdi-materials ) [tags_descriptions] => stdClass Object ( ) [category_id] => 27 [has_accepted_answer] => ) [5] => stdClass Object ( [id] => 267 [title] => High-Speed and HDI PCB Design Strategies by Syed Ubaid Ali Warsi [fancy_title] => High-Speed and HDI PCB Design Strategies by Syed Ubaid Ali Warsi [slug] => high-speed-and-hdi-pcb-design-strategies-by-syed-ubaid-ali-warsi [posts_count] => 1 [reply_count] => 0 [highest_post_number] => 1 [created_at] => 2023-10-25T11:29:50.457Z [last_posted_at] => 2023-10-25T11:29:50.531Z [bumped] => 1 [bumped_at] => 2023-10-25T11:29:50.531Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Originally published at: https://www.protoexpress.com/blog/high-speed-hdi-pcb-design-strategies/ Syed Ubaid Ali Warsi, the owner of Wavetroniks, provided his insights into high-speed and HDI PCB design strategies at … [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => high-speed [1] => hdi ) [tags_descriptions] => stdClass Object ( ) [category_id] => 21 [has_accepted_answer] => ) [6] => stdClass Object ( [id] => 139 [title] => Challenges with HDI routing [fancy_title] => Challenges with HDI routing [slug] => challenges-with-hdi-routing [posts_count] => 1 [reply_count] => 0 [highest_post_number] => 1 [created_at] => 2023-09-26T17:02:04.473Z [last_posted_at] => 2023-09-26T17:02:04.555Z [bumped] => 1 [bumped_at] => 2023-09-26T17:02:04.555Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => What are your biggest challenges when routing HDI boards? [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => routing [1] => hdi ) [tags_descriptions] => stdClass Object ( ) [category_id] => 27 [has_accepted_answer] => ) [7] => stdClass Object ( [id] => 857 [title] => Top 5 HDI PCB Routing Challenges and Ways to Mitigate Them [fancy_title] => Top 5 HDI PCB Routing Challenges and Ways to Mitigate Them [slug] => top-5-hdi-pcb-routing-challenges-and-ways-to-mitigate-them [posts_count] => 6 [reply_count] => 2 [highest_post_number] => 6 [created_at] => 2024-01-11T14:09:01.613Z [last_posted_at] => 2024-01-31T05:34:20.486Z [bumped] => 1 [bumped_at] => 2024-01-31T05:34:20.486Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Originally published at: https://www.protoexpress.com/blog/hdi-pcb-routing-challenges/ HDI designs pose complex routing challenges due to their tight spacing between components and traces. The use of DRC settings in … [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 27 [has_accepted_answer] => ) [8] => stdClass Object ( [id] => 1226 [title] => Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs [fancy_title] => Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs [slug] => case-study-designing-an-hdi-board-with-0-4-and-0-65-mm-bgas [posts_count] => 2 [reply_count] => 0 [highest_post_number] => 2 [created_at] => 2024-03-18T20:27:51.587Z [last_posted_at] => 2024-03-18T20:28:25.021Z [bumped] => 1 [bumped_at] => 2024-03-18T20:27:51.651Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Originally published at: https://www.protoexpress.com/blog/case-study-designing-hdi-board-with-4-and-65-mm-bgas/ BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, exc… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => bga ) [tags_descriptions] => stdClass Object ( ) [category_id] => 5 [has_accepted_answer] => ) [9] => stdClass Object ( [id] => 846 [title] => HDI PCB component clearance [fancy_title] => HDI PCB component clearance [slug] => hdi-pcb-component-clearance [posts_count] => 2 [reply_count] => 0 [highest_post_number] => 2 [created_at] => 2024-01-10T14:12:35.639Z [last_posted_at] => 2024-02-09T14:27:36.675Z [bumped] => 1 [bumped_at] => 2024-02-09T14:27:36.675Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => What is the ideal component clearance for an HDI board operating at 150 V? [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 34 [has_accepted_answer] => ) [10] => stdClass Object ( [id] => 856 [title] => HDI routing [fancy_title] => HDI routing [slug] => hdi-routing [posts_count] => 2 [reply_count] => 0 [highest_post_number] => 2 [created_at] => 2024-01-11T13:21:44.251Z [last_posted_at] => 2024-01-12T23:55:23.696Z [bumped] => 1 [bumped_at] => 2024-01-12T23:55:23.696Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => How does the increased component density on HDI PCBs impact the routing process, especially for complex designs? [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 27 [has_accepted_answer] => ) [11] => stdClass Object ( [id] => 248 [title] => 10 HDI PCB Design Tips to Maintain Signal Integrity [fancy_title] => 10 HDI PCB Design Tips to Maintain Signal Integrity [slug] => 10-hdi-pcb-design-tips-to-maintain-signal-integrity [posts_count] => 5 [reply_count] => 2 [highest_post_number] => 5 [created_at] => 2023-10-17T13:02:41.873Z [last_posted_at] => 2023-12-22T20:14:03.258Z [bumped] => 1 [bumped_at] => 2023-12-22T20:14:03.258Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Originally published at: https://www.protoexpress.com/blog/hdi-pcb-design-tips-for-signal-integrity/ When it comes to designing HDI PCBs, a plethora of challenges await, including complex routing requirements, issues… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 27 [has_accepted_answer] => ) [12] => stdClass Object ( [id] => 749 [title] => Ask Me Anything with Happy Holden [fancy_title] => Ask Me Anything with Happy Holden [slug] => ask-me-anything-with-happy-holden [posts_count] => 15 [reply_count] => 7 [highest_post_number] => 15 [created_at] => 2023-12-27T21:25:06.860Z [last_posted_at] => 2024-01-04T14:36:08.500Z [bumped] => 1 [bumped_at] => 2024-01-04T14:36:08.500Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Start posting your HDI questions now and Happy will answer on January 3rd! [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => hdi [1] => happy-holden ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [13] => stdClass Object ( [id] => 1467 [title] => BGA sizes issues [fancy_title] => BGA sizes issues [slug] => bga-sizes-issues [posts_count] => 8 [reply_count] => 2 [highest_post_number] => 8 [created_at] => 2024-05-29T14:16:37.039Z [last_posted_at] => 2024-06-03T12:40:05.609Z [bumped] => 1 [bumped_at] => 2024-06-03T12:40:05.609Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => I’m designing BGA routing of size 0.5 mm. Initially I used smaller via hole and diameter and track clearance. After validation with Sierra plugin, it warned, that minimum via hole is 0.2 mm, via diameter 0.4 mm and trac… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => bga ) [tags_descriptions] => stdClass Object ( ) [category_id] => 13 [has_accepted_answer] => ) [14] => stdClass Object ( [id] => 1394 [title] => Ask Me Anything about RF Materials [fancy_title] => Ask Me Anything about RF Materials [slug] => ask-me-anything-about-rf-materials [posts_count] => 5 [reply_count] => 1 [highest_post_number] => 5 [created_at] => 2024-05-07T19:20:06.897Z [last_posted_at] => 2024-05-11T00:17:15.457Z [bumped] => 1 [bumped_at] => 2024-05-11T00:17:15.457Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Do you need help choosing materials for your RF applications? Whether you wonder about fabrication challenges or low losses, we understand the importance of finding effective solutions. That’s why we’re thrilled to invi… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => pcb-materials [1] => materials [2] => rf ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [15] => stdClass Object ( [id] => 1238 [title] => Ask Me Anything with Mark Hughes [fancy_title] => Ask Me Anything with Mark Hughes [slug] => ask-me-anything-with-mark-hughes [posts_count] => 44 [reply_count] => 37 [highest_post_number] => 44 [created_at] => 2024-03-20T22:43:35.168Z [last_posted_at] => 2024-04-11T01:00:30.814Z [bumped] => 1 [bumped_at] => 2024-04-11T01:00:30.814Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => HOW TO MINIMIZE YOUR PCB PROJECT COSTS? Ask your questions in this thread and expert @mjhughes will reply on March 27th! [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [16] => stdClass Object ( [id] => 1230 [title] => Understanding Prepreg and Core [fancy_title] => Understanding Prepreg and Core [slug] => understanding-prepreg-and-core [posts_count] => 6 [reply_count] => 2 [highest_post_number] => 6 [created_at] => 2024-03-19T14:07:36.647Z [last_posted_at] => 2024-03-25T23:14:04.847Z [bumped] => 1 [bumped_at] => 2024-03-25T23:14:04.847Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => I’m trying to gain a better understanding of multilayer PCB structures. I’m struggling with understanding the roles of “prepreg” and “core.” Although I know they are involved in bonding the layers together, I’m uncertain… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 5 [has_accepted_answer] => ) [17] => stdClass Object ( [id] => 1210 [title] => Ask Me Anything with PCB West speaker Syed Ubaid Ali Warsi (high speed and EMC) [fancy_title] => Ask Me Anything with PCB West speaker Syed Ubaid Ali Warsi (high speed and EMC) [slug] => ask-me-anything-with-pcb-west-speaker-syed-ubaid-ali-warsi-high-speed-and-emc [posts_count] => 14 [reply_count] => 7 [highest_post_number] => 14 [created_at] => 2024-03-13T18:53:03.648Z [last_posted_at] => 2024-03-23T14:07:54.400Z [bumped] => 1 [bumped_at] => 2024-03-23T14:07:54.400Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Post your questions about high speed and EMC in this thread and Syed will reply on March 20th! THIS IS NOT A LIVE EVENT. You MUST post your questions ahead of this event so Syed can type in the answers. [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => high-speed [1] => emc ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [18] => stdClass Object ( [id] => 835 [title] => Ask Me Anything with Ethan Pierce [fancy_title] => Ask Me Anything with Ethan Pierce [slug] => ask-me-anything-with-ethan-pierce [posts_count] => 18 [reply_count] => 8 [highest_post_number] => 18 [created_at] => 2024-01-09T01:32:24.408Z [last_posted_at] => 2024-03-20T21:29:31.472Z [bumped] => 1 [bumped_at] => 2024-03-20T21:29:31.472Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => PCB West speaker Ethan Pierce will answer your IoT questions here. Start posting! [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => ama [1] => iot ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [19] => stdClass Object ( [id] => 1164 [title] => Component Placement Guidelines for PCB Design and Assembly [fancy_title] => Component Placement Guidelines for PCB Design and Assembly [slug] => component-placement-guidelines-for-pcb-design-and-assembly [posts_count] => 2 [reply_count] => 0 [highest_post_number] => 2 [created_at] => 2024-02-27T18:25:33.816Z [last_posted_at] => 2024-02-27T18:25:56.506Z [bumped] => 1 [bumped_at] => 2024-02-27T18:25:33.884Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Originally published at: https://www.protoexpress.com/blog/component-placement-guidelines-pcb-design-assembly/ In the era of miniaturization and HDI PCBs, space optimization on the PCB might frequently affect proper … [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 5 [has_accepted_answer] => ) [20] => stdClass Object ( [id] => 205 [title] => PCB Design for Assembly Checklist: 9 Important Checks for Layout Engineers [fancy_title] => PCB Design for Assembly Checklist: 9 Important Checks for Layout Engineers [slug] => pcb-design-for-assembly-checklist-9-important-checks-for-layout-engineers [posts_count] => 6 [reply_count] => 2 [highest_post_number] => 6 [created_at] => 2023-10-06T06:20:28.580Z [last_posted_at] => 2024-02-15T22:47:45.649Z [bumped] => 1 [bumped_at] => 2024-02-15T22:47:45.649Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Originally published at: https://www.protoexpress.com/blog/pcb-design-for-assembly-checklist-important-checks-for-layout-engineers/ Here’s a PCB design for assembly checklist you can refer to before you proceed with … [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 14 [has_accepted_answer] => ) [21] => stdClass Object ( [id] => 662 [title] => Ask Me Anything with Isola [fancy_title] => Ask Me Anything with Isola [slug] => ask-me-anything-with-isola [posts_count] => 20 [reply_count] => 10 [highest_post_number] => 20 [created_at] => 2023-12-04T18:21:56.170Z [last_posted_at] => 2023-12-16T06:06:53.546Z [bumped] => 1 [bumped_at] => 2023-12-16T06:06:53.546Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Have questions about Isola PCB materials? @michael.gay and @michael.mcmaster will reply on December 13th! [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [22] => stdClass Object ( [id] => 631 [title] => Panasonic Megtron availability at Sierra [fancy_title] => Panasonic Megtron availability at Sierra [slug] => panasonic-megtron-availability-at-sierra [posts_count] => 2 [reply_count] => 0 [highest_post_number] => 2 [created_at] => 2023-11-30T09:28:16.072Z [last_posted_at] => 2023-11-30T23:36:45.056Z [bumped] => 1 [bumped_at] => 2023-11-30T23:36:45.056Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => I was reading an e-book in HDI design and found that Panasonic Megtron is not mentioned in the list. Please indicate which material in the list is representing Megtron 4 or Megtron 6. [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 25 [has_accepted_answer] => ) [23] => stdClass Object ( [id] => 485 [title] => Ask Me Anything with Steve Bray [fancy_title] => Ask Me Anything with Steve Bray [slug] => ask-me-anything-with-steve-bray [posts_count] => 16 [reply_count] => 8 [highest_post_number] => 18 [created_at] => 2023-11-15T22:40:09.214Z [last_posted_at] => 2023-11-22T18:21:07.912Z [bumped] => 1 [bumped_at] => 2023-11-22T18:21:07.912Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Ask us your questions about PCB mass production and our own expert Steve Bray will answer on Wednesday November 22nd! [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => pcb [1] => mass-production [2] => pcb-fabrication ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [24] => stdClass Object ( [id] => 308 [title] => Ask Me Anything with Paul Cooke [fancy_title] => Ask Me Anything with Paul Cooke [slug] => ask-me-anything-with-paul-cooke [posts_count] => 27 [reply_count] => 13 [highest_post_number] => 27 [created_at] => 2023-11-06T17:53:48.165Z [last_posted_at] => 2023-11-15T21:52:41.749Z [bumped] => 1 [bumped_at] => 2023-11-15T21:52:41.749Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Ask your questions on PCB laminates and prepregs and speaker Paul Cooke will answer them! [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( [0] => pcb-materials [1] => laminates ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [25] => stdClass Object ( [id] => 290 [title] => Ask Me Anything with Atar Mittal [fancy_title] => Ask Me Anything with Atar Mittal [slug] => ask-me-anything-with-atar-mittal [posts_count] => 18 [reply_count] => 12 [highest_post_number] => 19 [created_at] => 2023-11-01T23:02:50.049Z [last_posted_at] => 2023-11-10T18:43:00.648Z [bumped] => 1 [bumped_at] => 2023-11-10T18:43:00.648Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Log in and ask your questions about high-speed PCB design! [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 74 [has_accepted_answer] => ) [26] => stdClass Object ( [id] => 278 [title] => The Future of PCB Etching by Laurent Nicolet [fancy_title] => The Future of PCB Etching by Laurent Nicolet [slug] => the-future-of-pcb-etching-by-laurent-nicolet [posts_count] => 1 [reply_count] => 0 [highest_post_number] => 1 [created_at] => 2023-10-30T15:34:35.980Z [last_posted_at] => 2023-10-30T15:34:36.053Z [bumped] => 1 [bumped_at] => 2023-10-30T15:34:36.053Z [archetype] => regular [unseen] => [pinned] => [unpinned] => [excerpt] => Originally published at: https://www.protoexpress.com/blog/future-of-pcb-etching-laurent-nicolet/ Laurent Nicolet, the Vice President of Business Units Electronics at the Schmid Group, talks about the future of wet a… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 23 [has_accepted_answer] => ) [27] => stdClass Object ( [id] => 31 [title] => About the Manufacturing category [fancy_title] => About the Manufacturing category [slug] => about-the-manufacturing-category [posts_count] => 1 [reply_count] => 0 [highest_post_number] => 1 [created_at] => 2023-09-05T22:24:42.804Z [last_posted_at] => [bumped] => 1 [bumped_at] => 2023-09-27T18:07:03.894Z [archetype] => regular [unseen] => [pinned] => 1 [unpinned] => [excerpt] => This category is for users who seek help or wish to share their experience with PCB manufacturing. Our subcategories are: Manufacturing process Choosing materials Flex and rigid-flex High-density interconnect (HDI) Mi… [visible] => 1 [closed] => [archived] => [bookmarked] => [liked] => [tags] => Array ( ) [tags_descriptions] => stdClass Object ( ) [category_id] => 23 [has_accepted_answer] => ) ) [users] => Array ( ) [categories] => Array ( ) [tags] => Array ( ) [groups] => Array ( ) [grouped_search_result] => stdClass Object ( [more_posts] => [more_users] => [more_categories] => [term] => hdi [search_log_id] => 6609 [more_full_page_results] => [can_create_topic] => [error] => [extra] => stdClass Object ( ) [post_ids] => Array ( [0] => 1770 [1] => 3496 [2] => 2675 [3] => 2058 [4] => 420 [5] => 424 [6] => 145 [7] => 2047 [8] => 3024 [9] => 2016 [10] => 2046 [11] => 379 [12] => 1771 [13] => 3826 [14] => 3626 [15] => 3134 [16] => 3101 [17] => 3016 [18] => 2347 [19] => 2835 [20] => 1889 [21] => 1643 [22] => 1374 [23] => 1051 [24] => 931 [25] => 794 [26] => 483 [27] => 34 ) [user_ids] => Array ( ) [category_ids] => Array ( ) [tag_ids] => Array ( ) [group_ids] => Array ( ) ) )