Manufacture And Assembly Equipment
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Laser Direct Imaging System
The System directly plots circuit image on to the panel which is laminated with the photoresist. Thereby, it avoids the total use of physical entity of lith films and also it replaces number of processes involved in preparing lith films.
Accuracy and precision of the circuit image is very high we can print the traces down to 2 mil without any issues
Orbotech Paragon 9000M
- 25 Microns features
- 160 scanned images per hour
- Powerful 355nm solid state laser High Resolution system
- Ideal for packaging ,flex , sequential build up and higher layer count product
Auto Cut Sheet Laminator
Used for the lamination of the photoresist and it has a special feature of cutting the photoresist on the panel itself, thereby avoiding loose laminar particle forming at the edges in normal cutting method.
Photo resist is photosensitive polymer which is laminated on copper clad which acts as a medium to transfer the circuit image from the source.
- Hakuto Mach 600
- Hakuto Mach 720i
Multiline VPE – 4 Camera System
This machine is used to punch the multi-line alignment holes into the silver halide films used for exposing the art works.
Multiline VPE – 4 Camera System
Post Etch Punch
This machine is used for punching the target alignment holes on to the inner layer core. This helps to stack the different cores in multilayer construction for proper registration.
Multiline OPE
Vacuum Lamination Press
This machine is used for laminating different cores of the multilayer which has circuit images already formed using Prepreg, arranged in sequential order with proper registration.
All the internal layer are bonded together with heat, pressure and vacuum.
In this machine, pressure is calculated in terms of force which depends on the panel dimension and number panels put together in a single press cycle.
Temperature profile depends on the TG of the laminate
Registration Drill System (OPL)
Pluritec Inspecta X Ray
This machine used for drilling the target holes which are located on layer 2 of multi-layer board which is covered with copper, machine identifies the target by x ray and drills the holes exactly to the centre of the target.
ESI Laser Drill
This laser system used for drilling the micro vias from 1 mil to 6 mil.
Selection of the laser via depends on the aspect ratio of the plating capabilities with respect to the stack up created.
This laser system uses CO2 and UV as the source of laser beam
Drill Machine
These are purely drilling machines with air bearing spindles which can run up to 200 K RPM and can drill as minimum as 4 mil holes diameter
These machines are built up with special features.
- You can load 600 drill bits to 2000 drill bits in the cartridge
- Broken drill detection system which detects the broken drill and replaces it with new drill
- This machine also verify the tool diameter with respect to the diameter specified in the programme
- Hitachi ND5L21OE
- Hitachi NR5E21OE
Electroless Copper Line
This Machine is used for copper plating (PTH ) hole barrel by electroless less method
Electroless Copper Line
Electrochemical Chemistry
Chemistry has sequential Process steps where in which copper gets deposited.
Electrochemical Chemistry
Strip Etch Strip Line
This machine is used for performing three functions in single line using different chemicals in different zones.
Process include striping of photo resist, etching the unwanted copper and stripping of the etch resist ( TIN )
Strip Etch Strip Line
Copper Plating Lines
Pulse and DC rectification sequential operation of copper plating by electroplating method.
Here plating is done to the tune of 1 mil inside the hole barrel.
Phastek
Organic Surface Protectant line
This Conveyorized machine used for surface finish called organic solvent preservative , which is the low cost process
Electrochemical OSP
De Burr
This machine is used for removal of the burr formed during drilling operation , This is process of mechanical abrasion using 320 grit brittles brushes both in top and bottom, there will be current loading factor which is calculated based on the board thickness to create the optimum pressure of brush on to the drilled boards
Marseco DBS 24
ETI West Super scrub – 20
The combination action of the abrasive pumice particles and nylon brushes tangent to the surface, removes all the contaminants and leaves a fresh virgin copper finish with a uniform surface.
No plug effect, no smearing, and no hole ovalization
Non-Conductive Via Fill
ITC THP30
Improved control and reduction in lead times, beneficial to improve the HDI process and enable via in pad technology.
Vacuum assisted resin fill
High Resolution Printer
It is 8 kW Exposure. Used to print the image of the solder mask layer.
- Olec 8000 Super Eight
- Glass to glass contact with vacuum
- Specially used for Exposing the solder mask layer
Tunnel Oven
Tunnel oven is used for curing of the solder mask printed on the board with the set of thermal profile.
Circuit Automation TC120
LPI Coater
This machine is used for coating or flood print of the solder mask ink on to the panel both sides simultaneously. ( LPI ink is coated)
Circuit Automation DP2500
Juki SMT Machine Line
Machine used for the assembly of the surface mount components which has sequential operation
- Paste printing
- Pick and place the SMD components
- Reflow ( solder )
- AOI ( optical inspection )
- Juki SMT Machine Line
- Assembled SMT Board
Flying Probe Tester
Machine is used for electrical testing of the bare pcbs without using any form of jigs and fixtures.
Machine is built up with probes , these probes go the desired co –ordinates and check of the continuity of nets and Isolation
Flying Probe Tester