HIGH DENSITY INTERCONNECT (HDI) PCBs Quote Now

Overview HDI Capabilities

Sierra Circuits' HDI Capabilities

VIA CAPABILITIES
Blind Via
Buried Via
Through hole
Blind Via
Buried Via
Through hole
Total Pad Size
Micro
3 mil over drill size
10 mil over drill size
10 mil over drill size
Advanced
6 mil over drill size
14 mil over drill size
14 mil over drill size
Standard
8 mil over drill size
20 mil over drill size
20 mil over drill size
Drill Size
Micro
9 mil
9 mil
9 mil
Advanced
4 mil
6 mil
6 mil
Standard
6 mil
10 mil
10 mil
Mechanically Drilled Annular Ring
3 mil
3 mil
Material Thickness
Micro
1 - 2 mil
Advanced
2.5 mil
Standard
4 mil
Capture Pad Size
Micro
9 mil
Advanced
4 mil
Standard
6 mil
Laser Aspect Ratio
Micro
9 mil
Advanced
4 mil
Standard
6 mil
MARKET CAPABILITIES
Aerospace
Medical
Military
Semiconductor
Layers
10 layers
10 layers
10 layers
8 layers
Material
FR4
Polyimide
FR4
FR4 - Lead Free
Finish Thickness
60 mils
64 mils
62 mils
64 mils
Trace
Inner: 3.9 mils
Inner: 3 mils
Inner: 3 mils
Inner: 3 mils
Outer: 3.9 mils
Outer: 3 mils
Outer: 3 mils
Outer: 5 mils
Space
Inner: 3.9 mils
Inner: 3 mils
Inner: 2.9 mils
Inner: 3.56 mils
Outer: 3.9 mils
Outer: 3 mils
Outer: 3 mils
Outer: 3.53 mils
Number of Laminations
4 laminations
4 laminations
4 laminations
2 laminations
Surface Finish
Immersion gold
Immersion gold
Immersion gold
Immersion gold
Minimum Hole Size
8 mils
6 mils
8 mils
6 mils
Pitch
None
0.4 mm
0.8 mm
0.4 mm
BOARD TYPES
Product Features
Standard
Advanced
Micro
Rigid PCB
Yes
Flex and RigidFlex
Yes
HDI
Sequential Lam
1 - 2
1 - 3
Buried Vias
1 - 2
1 - 3
Blind Vias
Yes
Stacked Vias
Yes
Filled Vias
Conductive
Yes
Non-Conductive
Yes
Copper Plate Shut Micro Vias
Yes
Heat Sinks
Yes
UL
94V-0 on select materials
Yes
QUALITY REPORTS
Product Features
Standard
Advanced
Micro
Specifications
IPC-6012, Class 1, 2, 3, & 3A
Yes
IPC-6013, Class 1, 2 & 3
Yes
MIL-PRF-55110 on selected materials.
Yes
Reports / Certificates
Micro section
Yes
Solderability
Yes
X-ray Fluorescence
Yes
Ionic Contamination
Yes
Time Domain Reflectometry (TDR)
Yes
First Article Inspection (FAI)
Yes
Certificate of Compliance (C of C)
Yes
Electrical Test
Yes
CONSTRUCTION
Product Features
Standard
Advanced
Micro
Panel Size
Available Panel Sizes
12" x 18",
18" x 24"
14" x 26",
21 x 25",
21" x 29"
Thickness
Min Board Thickness
.010"
.004"
 
Max Board Thickness
.200"
.200" +
 
Thickness Tolerance
10%
< 10%
 
Bow & Twist Tolerance
7%
<7%
Layers
Max Layer Count
24
26+
Dielectric
Minimum Core Thickness
.002"
< .002"
 
Minimum Dielectric
.002"
.001"
Foil
Starting Copper Foil Weight
1/2 oz, 9 micron
1 micron
PREFERRED MATERIALS
(see document for all approved materials)
Product Features
Standard
Advanced
Micro
FR-4 Lead Free
Isola 370 HR
Yes
 
 
 
Nan Ya NP-175F
Yes
 
 
 
Nan Ya UV BLOCK FR-4-86
Yes
 
 
 
Nan Ya NPG-170
Yes
 
 
 
Nelco N4000-13SI
Yes
 
 
Polyimide
Isola P95
Yes
 
 
 
Nelco N7000-2 VO
Yes
 
 
Teflon
Nelco N9000-13 RF
 
Yes
 
 
Rogers RO3000 Series
 
Yes
 
 
Rogers RT/DUROID Series
 
Yes
 
 
Rogers ULTRALAM 2000
 
Yes
 
Ceramic
Rogers RO4003
 
Yes
 
 
Rogers RO4230
 
Yes
 
 
Rogers RO4350 F
Yes
 
 
 
Rogers RO4350
Yes
 
 
 
Rogers TTM 3, 4, 6, 10, 10i
Yes
 
 
 
Taconics CER-10
Yes
 
 
 
Taconics RF-35A2
 
Yes
 
 
Taconics RF-60
 
Yes
 
Cyanate Ester
Nelco N8000
Yes
 
 
Bond Sheet
Hitachi 671N
Yes
 
 
 
Rogers RO4450B, RO4450F
Yes
 
 
Flex
DuPont Pyralux AP
Yes
 
 
 
DuPont Pyralux LF
Yes
 
 
 
DuPont Pyralux FR
Yes
 
 
Resistor
Rogers RO4003 / 4350 TICER TCR
 
Yes
 
Thermal
Thermagon 88
 
Yes
 
 
Laird IMPCB
 
Yes
 
DRILL
Product Features
Standard
Advanced
Micro
Laser
Smallest / Largest Laser Drill Diameter
.004" / .008"
.003" / .010
 
 
Maximum Aspect Ratio
.75:1
>.75:1
 
Mechanical
Minimum Diameter
.0059"
.004"
 
 
Maximum Aspect Ratio
10:1
> 10:1
 
 
Minimum Drill to Copper
0.007
0.005
 
Tolerance
Minimum Plated Thru Holes
+/-.002
 
 
 
Minimum Non Plated True Holes
+/-.001
 
 
PAD DIAMETER
Product Features
Standard
Advanced
Micro
Outer Layer
Rigid
Drill + .008" + (AR * 2)
Drill + .006" + (AR * 2)
 
 
Flex
Drill + .010" + (AR * 2)
Drill + .008" + (AR * 2)
 
Inner Layers
Rigid
Drill + .010" + (AR * 2)
Drill + .008" + (AR * 2)
 
 
Flex
Drill + .012" + (AR * 2)
Drill + .010" + (AR * 2)
 
CONDUCTORS
Product Features
Standard
Advanced
Micro
Pad Sizes
Minimum Pad Size for Electrical Test
0.0050"
0.0030"
 
 
Minimum wire bond pad size
0.0060"
0.0040"
 
Minimum Trace vs. Copper Thickness Note: Thickness includes starting foilplus panel plates (for wrap if any) to beetched.
0.00020" (5 micron)
0.0025"
0.0020"
 
0.00035" (9 micron / 1/4 oz)
0.0030"
0.0025"
 
Note: Thickness includes starting foilplus panel plates (for wrap if any) to beetched.
0.00053" (3/8 oz)
0.0035"
0.0030"
 
 
0.0007" (1/2 oz)
0.0040"
0.0035"
 
 
0.0014" (1 oz)
0.0050"
0.0045"
 
 
0.0028" (2 oz)
0.0065"
0.0060"
 
 
0.0042" (3 oz)
0.0070"
0.0065"
 
 
> 3 oz
Contact Sierra
 
 
Minimum Space vs. Copper Thickness Note: Thickness includes starting foilplus panel plates (for wrap if any) to beetched.
0.00020" (5 micron)
0.0025"
< 0.0025"
 
0.00035" (9 micron / 1/4 oz)
0.0030"
< 0.0030"
 
Note: Thickness includes starting foilplus panel plates (for wrap if any) to beetched.
0.00053" (3/8 oz)
0.0035"
< 0.0035"
 
 
0.0007" (1/2 oz)
0.0040"
< 0.0040"
 
 
0.0014" (1 oz)
0.0050"
< 0.0050"
 
 
0.0028" (2 oz)
0.0065"
< 0.0065"
 
 
0.0042" (3 oz)
0.0070"
< 0.0070"
 
 
> 3 oz
Contact Sierra
 
 
PERMANENT SOLDER MASK
Product Features
Standard
Advanced
Micro
Liquid Photoimageable (LPI)
Color
Green, Red, Blue, Yellow
 
 
 
Gloss
Semi - Gloss
Matte
(Only in Green)
 
 
 
Minimum Dam/Web Size SMT
0.0040
 
 
 
Minimum Dam/Web Size BGA
0.0035
 
 
 
Clearance
=/> 0.0015
 
 
 
Mask-Defined SMT or BGA (not Ground Plane)
No
 
 
 
Mask-Defined Features on Ground Plane
Yes
 
 
Laser Direct Imaging (LDI)
Color
Green Only
 
 
 
Gloss
Semi - Gloss
 
 
 
Minimum Web for SMT
0.0035
 
 
 
Minimum Web for BGA
0.0030
 
 
 
Clearance
0 - 0.0014
 
 
 
Mask-Defined SMT or BGA (not Ground Plane)
Yes
 
 
LEGEND
Product Features
Standard
Advanced
Micro
Printar
Color
White
 
 
 
Minimum Line / Height
.005/.025"
 
 
Screen Printable
Color
White, Yellow, Black, Red
 
 
 
Minimum Line/Height
0.007/0.030"
 
 
SURFACE FINISHES
Product Features
Standard
Advanced
Micro
Types
HASL (Vertical & Horizontal)
Yes
 
 
 
Lead Free HASL
Yes
 
 
 
OSP (Shikoku F2 & Entek)
Yes
 
 
 
ENIG (Electroless Nickel / Immersion Gold)
Yes
 
 
 
ENEPIG
(Electroless Nickel-Electroless Paladium-Immersion Gold)
Yes
 
 
 
Immersion Silver
Yes
 
 
 
Tin Nickel
Yes
 
 
 
Electrolytic Soft Gold
Yes
 
 
 
Electrolytic Hard Gold
Yes
 
 
FABRICATION
Product Features
Standard
Advanced
Micro
Mechanical
Minimum Route Cutter Available
.024"
.021"
 
 
Routed Part Size Tolerance
.010"
<.010"
 
 
Countersink
Yes
 
 
 
Counter bore
Yes
 
 
 
Bevel Angles
20, 30, 45
 
 
Laser
Milling, Depth Tolerance
+/-.003
 
 
 
Laser Routed Thickness
<.032" thick
<.032" thick
 
 
Routed Array
Yes
 
 
V Score
V Score Angles
30, 45, 60
 
 
 
V Score, edge-to-copper
0.01
0.007
 
Dicing
Dicing, edge-to-copper
0.005
 
 
Edge / Castellation
Edge Castellation, Minimum Drill Dia
0.020"
 
 
 
Edge Plating
Yes
 
 
OTHER SCREENABLE MATERIAL
Product Features
Standard
Advanced
Micro
Carbon Ink
 
Yes
 
 
Peelable Solder Mask
 
Yes
 
 
ELECTRICAL TEST
Product Features
Standard
Advanced
Micro
Controlled Impedance
Tolerance
10%
5%
 
Hi Pot
 
Yes
 
 
Test Voltage
 
40
250, 500
 
Isolation Resistance (Mohms)
 
100
>100
 
Continuity Resistance (Ohms)
 
10
<10
 
Minimum Pad Size
 
0.005
0.003