Burn-in Boards

Burn-In Boards are boards that are used in the process of electrically stressing a device at an elevated temperature, for a sufficient amount of time to cause the failure of marginal devices (Infant Mortality).
Call and speak to an Account
Representative about
your order, products and more
1-800-763-7503 x 500

Sierra Circuit's Burn-In Boards Capabilities:

  Layer Count 
     Up to 12 layers 0.062" thickness
     Up to 14 layers 0.067" thickness
     Up to 16 layers 0.093" thickness
  Board Size

12" x 24" and smaller
19" x 23"
23" x 27"
  Materials

Nelco 4000-13
Polyimide 55ST
Thermount 55 ST, 85 MT
BT
  Pitch Min 0.5 mm
  SMT and Through Hole
  HASL Boards
  Imaging 
     Min Line/Space 0.003/0.003
     Surface Mt Pad 0.008
     Layer to Layer Reg +/-0.002
  Lamination
     Max Layers 30
     Min/Max Thickness .0002/.0280
     Overall Thickness +/- 8%
     Bow & Twist  0.7%
  Drill and Routing
     Hole Location 0.004
     Finished Hole Size  0.006
     Tolerance (PTH) +/-0.001 inches
     Tolerance (NPTH)  +/-0.001 inches
     Min Drill Size  0.006
     Aspect Ratio  20:1
     Min Pad to Hole (I/L)  Finished Hole Size + 0.010 inches
     Min Plane Relief  Finished Hole Size + 0.025 inches
  PCB Plating
     Electroless Ni 100 micro inches
     Immersion Au  3 - 5 micro inches
     Copper  0.003 inches
     Nickel  0.0003 - 0.0005 inches
     Solder  0.0001 - 0.001 inches
     Max Gold  50 - 100 micro inches
  PCB Etch Factors
     Inner Layer + 0.0005 inches
     Outer Layer  + 0.0005 inches
     Controlled Imp  +/-5%
  Solder Mask
     Min Clearance  0.002 /side
     Min Lay Down 0.002 inches
     Color  Most colors available
  Nomenclature/Legend
     Minimum Line Width  0.005 inches
     Color  White (other colors available on request)

Call today to speak with an Account Representative at 1-800-763-7503 x 500.
To get a quote submit your gerber files to www.protoexpress.com/customquote