Burn-in Boards

Burn-In Boards are boards that are used in the process of electrically stressing a device at an elevated temperature, for a sufficient amount of time to cause the failure of marginal devices (Infant Mortality)

Sierra Circuit's Burn-In Boards Capabilities

Layer Count

Up to 12 layers

0.062" thickness

Up to 14 layers

0.067" thickness

Up to 16 layers

0.093" thickness

Board Size

12" x 24" and smaller

19" x 13"

23" x 27"

Materials

Nelco 4000-13

Polyimide 55ST

Thermount 55 ST, 85 MT

BT

Pitch

Min 0.5 mm

SMT and Through Hole

HASL Boards

Imaging

Min Line/Space

0.003 / 0.003

Surface Mt Pad

0.008

Layer to Layer Reg

+/-0.002

Lamination

Max Layers

30

Min/Max Thickness

.0002/.0280

Overall Thickness

+/- 8%

Bow & Twist

0.7%

Drill and Routing

Hole Location

0.004

Finished Hole Size

0.006

Tolerance (PTH)

+/-0.001 inches

Tolerance (NPTH)

+/-0.001 inches

Min Drill Size

0.006

Aspect Ratio

20:1

Min Pad to Hole (I/L)

Finished Hole Size + 0.010 inches

Min Plane Relief

Finished Hole Size + 0.025 inches

PCB Plating

Electroless Ni

100 micro inches

Immersion Au

3 - 5 micro inches

Copper

0.003 inches

Nickel

0.0003 - 0.0005 inches

Solder

0.0001 - 0.001 inches

Max Gold

50 - 100 micro inches

PCB Etch Factors

Inner Layer

+ 0.0005 inches

Outer Layer

+ 0.0005 inches

Controlled Impedance

+/-5%

Solder Mask

Min Clearance

0.002 /side

Min Lay Down

0.002 inches

Color

Most colors available

Nomenclature/Legend

Minimum Line Width

0.005 inches

Color

White (other colors available on request)

Call today to speak with an Account Representative at 1-800-763-7503 x 500.

To get a quote submit your gerber files to www.protoexpress.com/customquote