Hoa Do, a Senior Package Engineer at Xilinx, details his experiences within the industry for us at SEMICON West.
Xilinx specializes in semiconductor FBGA development work, and produces chips for circuits boards and data centers. For Do, who works in the thermal side of the electronics, the main issues include dissipating the heat of the chip, and the issues surrounding high-power components. The interview in its entirety is below.
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