Flexpert Vern Solberg will be presenting at PCB West. If you want to learn a little more about flexible and rigid-flex PCBs, this session is exactly what you’ve been looking for. Vern is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the electronics industry for more than twenty-five years in areas related to both commercial and aerospace electronic product development and is active as an author and educator. He will be presenting on Thursday, September 17, at the Santa Clara Convention Center.
Design and Assembly Process Principles for Flexible and Rigid Flex Circuits
Thursday, 9:00 am — 12:30 pm
The design guidelines for flexible circuits, although similar to rigid circuits, are somewhat unique. In essence, flex-circuits furnish unlimited freedom of packaging geometry while retaining the precision density, and repeatability of printed circuits. Flex-circuits typically replace the common hard-wire interface between electronic assemblies. The flexible circuits, however, have significant advantages over the hard-wired alternative because they fit only one way, eliminate wire routing errors, and save up to 75% on space and weight. Because the flex-circuit conductor patterns can maintain uniform electrical characteristics they contribute to controlling noise, crosstalk, and impedance. The flex-circuits will often be designed to replace complex wire harness assemblies and connectors to further improve product reliability.
During the workshop program participants will have an opportunity to review and discuss the latest revision of PC-2223, Sectional Design Standard for Flexible Printed Boards that include base material sets, alternative fabrication methodologies and SMT-on-flex assembly processes. The workshop will also furnish practical flex circuit supplier DfM recommendations for ensuring quality, reliability and manufacturing efficiency.
Topics of discussion:
Applications and use environment
• Establishing end use criteria
Designing flexible and rigid-flex circuits
• Flex circuit outline planning
• Circuit routing and interconnect methodologies
• Fold and bend requirements
• SMT land pattern reinforcement criteria
Material and SMT components
• IPC standards for flex and rigid-flex dielectrics
• Base material and metallization technologies
• Selection criteria for SMT components
• SMT land pattern development
Assembly processing of flex and rigid-flex circuits
• Dimensioning and tolerance criteria
• Palletized layout for in-line assembly processing
• SMT assembly process variations and methodologies
• Alternative joining methods for flexible circuits