At some level of circuit complexity, turning to an architecture with blind and buried vias will result in better yield and lower cost than would a through-hole design. In this presentation, we discuss several design examples and illustrate the relative costs and benefits of different architectural approaches.
Continue reading “HDI Considerations: Manufacturability and Cost”
Designing a flex printed circuit board requires a slightly different approach than rigid PCBs. While flex PCBs can provide major savings in manufacturing cost as well as reduced space consumption and lower weight compared with rigid, their design must be optimized for their materials and use cases. Continue reading “5 Must-Knows for Your First Flex Design”
High density interconnect represents the cutting edge of the printed circuit board industry today, due to demand for more compact PCBs and stronger signal integrity discipline. Continue reading “Becoming a PCB Master: HDI”
Choosing the right dielectric material for a PCB is important no matter what application you’re working on, but the stakes are higher with High Density Interconnect (HDI) technologies. Continue reading “HDI PCBs: Choosing The Right Material”
In technology, nothing is possible until it is practical. For the wearables market, nothing is practical until it is fashionable. MIT experimented with head-mounted monstrosities in the early 1990s; a time before the World Wide Web was referred to as “the web.” That concept did not work. Continue reading “The State of Wearable Technology”
Printed circuit boards play a major role in determining the success or failure of any quickturn project. There are many factors—and therefore many potential mistakes—that PCB layout engineers and other professionals have to avoid to enjoy the benefits of quickturn PCBs. Continue reading “7 Key Mistakes to Avoid for Quickturn PCBs”
