A transmission line should have a uniform characteristic impedance. Any variation or discontinuities to the impedance causes signal reflection and distortion. Continue reading “How Impedance Discontinuities Affect Signal Integrity”
Tag: Via
HDI Considerations: Manufacturability and Cost
At some level of circuit complexity, turning to an architecture with blind and buried vias will result in better yield and lower cost than would a through-hole design. In this presentation, we discuss several design examples and illustrate the relative costs and benefits of different architectural approaches.
Continue reading “HDI Considerations: Manufacturability and Cost”
5 Must-Knows for Your First Flex Design
Designing a flex printed circuit board requires a slightly different approach than rigid PCBs. While flex PCBs can provide major savings in manufacturing cost as well as reduced space consumption and lower weight compared with rigid, their design must be optimized for their materials and use cases. Continue reading “5 Must-Knows for Your First Flex Design”
Becoming a PCB Master in HDI
High density interconnect represents the cutting edge of the printed circuit board industry today, due to demand for more compact PCBs and stronger signal integrity discipline. Continue reading “Becoming a PCB Master in HDI”
HDI PCBs: Choosing The Right Material
Choosing the right dielectric material for a PCB is important no matter what application you’re working on, but the stakes are higher with High Density Interconnect (HDI) technologies. Continue reading “HDI PCBs: Choosing The Right Material”
The State of Wearable Technology
In technology, nothing is possible until it is practical. For the wearables market, nothing is practical until it is fashionable. MIT experimented with head-mounted monstrosities in the early 1990s; a time before the World Wide Web was referred to as “the web.” That concept did not work. Continue reading “The State of Wearable Technology”
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