When customers want to design HDI boards that are as compact as possible, there is often very little reliable guidance from the chip vendors. Heed the warnings of Texas Instruments: Consult board manufacturers from the start of any projects involving BGAs with a pin pitch of 0.4 mm and smaller.
After PCB West 2018 Exhibition Day, we presented our new 1-mil trace and space patented technology.
At some level of circuit complexity, turning to an architecture with blind and buried vias will result in better yield and lower cost than would a through-hole design. In this presentation, we discuss several design examples and illustrate the relative costs and benefits of different architectural approaches.
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