One thing PCB designers will all agree on is that to breakout a BGA, you need precision and discipline. When you breakout a BGA, you basically apply a fanout solution and route traces from those fanouts to the perimeter of the device prior to general routing of the PCB.
High density interconnect (HDI) technology is far more than the miniaturization of circuit design. It represents a significant breakthrough in our industry. Continue reading “The History of High Density Interconnect”
For some designs, using HDI can save you time and cost. Make sure your HDI board is being correctly designed. HDI expert Happy Holden was kind enough to send over a few tips and suggestions. Here are a few things to keep in mind when using HDI in your next PCB design. Continue reading “Tips for Designing HDI PCBs”
Designing, ordering and receiving your printed circuit board should be a seamless process. Ideally, you could verify your design, receive an instant quote, and then begin ordering your components within minutes. Continue reading “What to Expect After Ordering Your PCBs”
Here is the first of many HDI examples we will be sharing. This is a .4mm BGA pitch on a 6×6 matrix. It has 4 – 5 mil trace/space, with 4 mil lasers and 8 mil pads. The routing strategy includes stacked and staggered vias. Continue reading “HDI Stackup: Routing A .4mm Pitch”
SIGN UP FOR NEW ARTICLES AND UPDATES