Predicting Field Failure From Small Environmental Stresses

<h1>Predicting Field Failure From Small Environmental Stresses</h1> post thumbnail image

Doug Smith, the author of High-frequency Measurements and Noise in Electronic Circuits, led the latest IPC Designers Council at Cadence on April 26th. The topic was: Predicting field failure from small environmental stresses for high-quality PCBs.

 

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