PCB Via Quiz

by | May 18, 2020 | 0 comments

The miniaturization of electronic devices was made possible thanks to the advancements in PCB via technology. Manufacturers get a bit dizzy when PCB designers don’t follow the rules concerning their via specs. Find out how well you know about this topic in this PCB via quiz.

 

Results

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#1. What is the ideal aspect ratio for microvia?

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#2. Why is it better to have a larger aspect ratio for vias?

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#3. What is the main difference between plated holes (PTH) and non-plated holes (NPTH)?

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#4. Which via should be used to save space on the outer layers of a PCB?

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#5. Which of these statements about via hole drilling is false?

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#6. What is another name for pad to hole ratio in a via?

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#7. According to IPC standards, the diameter of buried and blind vias should be:

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#8. What is the main reason to choose via-in-pad over conventional vias?

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#9. Why does via-in-pad require a non-conductive epoxy fill?

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#10. What is back-drilling?

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#11. When do you implement back-drilling?

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#12. Which of these are not part of the PCB via finish process?

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