The miniaturization of electronic devices was made possible thanks to the advancements in PCB via technology. Manufacturers get a bit dizzy when PCB designers don’t follow the rules concerning their via specs. Find out how well you know about this topic in this PCB via quiz.

Results

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#1. What is the ideal aspect ratio for microvia?

10:1

5:1

0.75:1

2:1

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#2. Why is it better to have a larger aspect ratio for vias?

Reliability of the plated through hole will be higher and can be easily manufactured

Larger aspect ratios eliminate the need for via copper plating

Larger aspect ratios are more cost-effective

None of the above

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#3. What is the main difference between plated holes (PTH) and non-plated holes (NPTH)?

PTH conduct signals whereas NPTH are used to position components

NPTH are more cost-effective than PTH

PTH cut down on parasitic inductance whereas NPTH do not

PTH and NPTH have different tolerances

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#4. Which via should be used to save space on the outer layers of a PCB?

Through-hole via

Blind via

Buried via

Microvia

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#5. Which of these statements about via hole drilling is false?

Mechanical drilling is used for through-holes and back drilling

Laser drilling is used for blind and buried holes

Laser drilling is used for through-holes and buried holes

Laser drilling enables smaller drill diameters than mechanical drilling

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#6. What is another name for pad to hole ratio in a via?

Annular ring

Aspect ratio

Drill to pad ratio

Both 1 and 2

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#7. According to IPC standards, the diameter of buried and blind vias should be:

≦ 6 mils

≦ 5 mils

≦ 7 mils

≦ 4 mils

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#8. What is the main reason to choose via-in-pad over conventional vias?

To handle high package densities in HDI boards where routing is critical

To decrease the manufacturing cost of a PCB

To increase signal integrity

To increase the structural integrity of the PCB

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#9. Why does via-in-pad require a non-conductive epoxy fill?

To improve thermal insulation between laminates

To provide insulation between the interconnecting hole and the footprint

To add to ease of manufacturing

To be cost-effective as compared to soldermasking

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#10. What is back-drilling?

Holes drilled for mounting component

Drilling technique used to remove the via stubs to avoid signal distortions

Drilling technique used for deburring and desmearing

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#11. When do you implement back-drilling?

Minimizing aspect ratio

Using conductive epoxy via fill for the via-in-pad

Planarization of copper plating

When multiple blind vias are placed symmetrical to both external ends of the PCB

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#12. Which of these are not part of the PCB via finish process?

Desmearing

Deburring

Delamination

Plating

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