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#1 When using lead-free solder, you must choose materials that:
Have a higher decomposition temperature
Are generally higher quality overall
All of the above
#2 In an HDI stack-up, what does the resin matrix provide?
The dielectric properties and resistance that unifies highly conductive layers
The dielectric properties and resistance that separates highly conductive layers
The dielectric properties and resistance that separates non-conductive layers
#3 What is true about resin matrix?
It has a low water absorption property
It has a low glass transition temperature
It has a low heat resistance
#4 Which of the following are not copper foil properties?
Electric circuit and signal line
Flammability and low warpage
Grounding and heat dissipation
#5 What can we say about glass cloth?
It has a dimensional stability and low CTE
It has a dimensional stability and high CTE
It is unstable and has a high warpage
#6 What does CTE mean?
Coefficient of temperature expansion
Coefficient of thermal extension
Coefficient of thermal expansion
#7 What do medium speed materials have?
The flattest Dk versus frequency response
A lower dielectric loss
A higher dielectric loss
#8 What are the application areas for the FR4 family?
Medium speed and loss
High signal integrity
All of the above
#9 What is the type of the RO 4003C material?
HC/Ceramic, glass reinforced