Michael Steinberger DesignCon 2016 Interview
DesignCon is the largest show with a strategic focus on design. From signal integrity to power integrity to power distribution to the recent emergence of PAM-4, the knowledge gained at DesignCon is wholly unique, and unlike any other show. Sierra interviewed experts and leaders to share tips and discuss where they see our industry heading.
Below is the fifth of ten interviews from DesignCon 2016. Michael Steinberger is lead architect for SiSoft. He has over 30 years of experience designing very high speed electronic circuits. At DesignCon he spoke about signal integrity techniques for large system performance tuning.
Michael’s Tip of the Day
Vias have become a primary source of discontinuities on transmission paths. As such, engineering them correctly has become a serious challenge, as has the analysis of them. The hybrid field solver dramatically reduces the amount of compute time needed in order to analyze a particular via design.
Can’t get enough of our DesignCon videos? Check out our 2016 show recap.Tags: DesignCon, interview, trade show, Via