Sierra met Howard Liu, Global Cooperation Director at Vayo Technology, during DesignCon 2018. He talked about Vayo’s DFM tools that help PCB designers and engineers to get error-free designs to then focus on the work site.
0:07 Can you tell us about your software?
I think very importantly, the industry changes very fast, and there are always new people, new engineers joining the industry. And they might be short of knowledge at the beginning. So it’s quite important that you could offer some error proof tools to help them get quickly familiar with the design, then focus on the work site.
With our DFM tools, which can help them to find the essential design mistakes, PCB designers can focus on the function of the product.
“We can virtually assemble boards.”
0:50 Can your DFM tools take care of the whole range of design issues?
Yes, our software can find out the design effects, the components, the assembly problems, and even mass production issues. Also product reliability with assimilation technology, with components, we can virtually assemble boards, it’s like a virtual reality tool. Then we can find most of the problems in advance, which can accelerate the prototyping.
1:33 How does simulation help designers?
Designers just focus on the PCB, but with the real components from our component entity libraries, they are able to see a virtual product, virtually assemble that product, and finalize it in our software. Then the software can perform comprehensive analysis, they will see in which location there are some problems, whether or not there are some conflicts, and then they could quickly find a solution. That’s simulation we offer for the industry.
Moreover, in the past, the industry has just been offering 2D DFM solutions. Recently, we have released 3D solutions for the industry. That means that from now on, our customers could provide 3D DFM reports to their customers. Their customers are more understanding and are critical to the problem.
2:44 Are you considering increasing the scope to simulate functional areas?
It comes with some challenges, but it’s just basically dimension and physical moves to the functions. We have some other solutions like DFT. For DFT, we analyze some electrical sides, we analyze each test approach to find the problem. That’s what we provide.
3:19 Can you elaborate more on DFTs?
There are two levels of DFT. For the first level of DFT, people just find the test probe access for the ICT, which is a test that couldn’t put probe. That’s the first level, it’s just a physical access to the layer, to the trace.
Then we have the second level. The second level means that we estimate the test coverage for different test probes, like ICT flying probe, XY, AY, even functional test. We do analysis when the test can cover the majority of defects of a component, like missing, open, short, round polarity. Then we estimate the coverage for different test approach.
4:36 Can your software interact with flying probe testers?
We have been dedicated to the testing field for 13 years. And we have the collection, we can generate the output for flying probe testing, for MDA or AT testers. Then based on this knowledge, we can know the coverage of each tester. Then we can combine them to a second level or high-level DFT test beta report.
5:05 What’s your favorite part about DesignCon?
With the design for an excellent product, people can move further and focus more on the design side. They don’t need to worry about some essential problems of the photo library. We solve the problems with the automation software tools.