The main agenda of using HDI technology is to pack more components on a smaller board. Choosing smaller footprints for HDI increases board functionality and component density. Therefore, while designing a high-density interconnect board there are many problems to...
Design for manufacturability (DFM) for HDI PCBs refers to designing layouts that reduce the errors associated with fabrication and assembly. Before fabrication, the manufacturer will run a set of checks on the board files (Gerbers or ODB++) to confirm that these files...
Impedance matching is the way of configuring the input impedance of a load or the output impedance of its signal source. It is performed to achieve maximum power transfer and reduce the signal reflections from the load. In other words, for proper impedance control,...
Miniaturization of the copper features in electronic circuits results from placing interconnections closely with a high packing density. As a result, crosstalk in HDI PCB substrate comes at play because of the increased coupling between the adjacent signal lines. HDI...
In this article, we will cover the HDI PCB cost and manufacturing best practices and why it makes sense to use HDI in some applications. Topics which we are going to be covered in this blog post: The hidden economy of HDI More than just simply layers and laminations...
Choosing the right dielectric material for a PCB is important no matter what application you’re working. However, the stakes are higher with high-density interconnect (HDI) technologies. They’re small, light, and powerful, yet they have specific construction...
Use these four tips to become a high density interconnect printed circuit board design master.
The digital world is getting complex hour by hour whereas the hardware associated with it is getting drastically smaller. The advantages of HDI PCBs are numerous, starting with more interconnections in smaller areas. This results in the miniaturization of boards that...
One thing PCB designers will all agree on is that to breakout a BGA, you need precision and discipline. When you breakout a BGA, you basically apply a fanout solution. You route traces from those fanouts to the perimeter of the device prior to general routing of the...