HDI PCB is a complex technology that uses blind, buried and micro vias. HDI is characterized by its high density of components and routing interconnections, which can pain a pain to design for. Can you handle it? Take the quiz!
Well, well, well, looks like someone is ready to order HDI! Have you read our
HDI Design Guide
? Maybe you could still learn a few tricks and give us your feedback!
#1. What is true about microvias?
The current standard aspect ratio for a microvia is 0.75:1.
The microvia structure affects the number of lamination cycles.
The microvia diameter should be smaller than the height of the material it is penetrating to the next adjacent layer. #2. What does HDI stand for?
Heat Dissipation In electronics
High Dielectric Interconnect
High Density Interconnect #3. The total number of layers of your final HDI PCB is determined by:
BGA (or the highest pin count device).
The number of signal layers, as well as the number of power and ground layers.
All of the above. #4. What is the final manufacturing step of a 0-N-0 stack-up with laser microvias?
The final through-hole via is formed.
The core is laminated.
The mechanical drill is plated. #5. What does BGA stand for?
Ball grid array
Bare grid array
Board grid array #6. When you are breaking out of a tight pitch BGA, like .3 mm, you need to:
Have microvias stacked on top of each other.
Only opt for staggered microvias.
Alternate between blind and buried vias. #7. Which of the following applies to staggered microvias?
Hole fill required.
No extra imaging step.
Planarization required. #8. How can you reduce crosstalk in HDI substrates?
By using lower dielectric constant materials.
By using longer coupled lengths.
By using longer distances to the reference planes. #9. What is considered a good practice when it comes to surrounding signal layers in HDI?
Using power planes.
Using ground planes.
Using mixed planes. #10. What type of surface finish is it recommended to use in a HDI board?
HASL because it is rough enough to put on BGAs.
HAL because it is choppy.
ENEPIG because it is an electrolytic-less gold. #11. Which of the following is a requirement in a 1-N-1 stack-up with microvias stacked on top of buried and filled core vias?
The buried core vias should be filled and plated after adding the additional two layers.
The microvias need to be plated with copper and planarized flat.
All of the above.
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