Eric Bogatin at DesignCon 2017

DesignCon 2017 is nearly upon us, and we can’t wait to learn from all the leaders and experts this year. Want to learn from the leading expert in Signal Integrity—and last year’s Engineer of the Year? Visit Eric Bogatin at Teledyne LeCroy Booth 733, Signal Integrity Journal Booth T2, or attend one of his sessions. Check out Eric’s schedule here, or view his sessions down below.

Panel: Briefing from the IEEE P370 Working Group: Electrical Characterization of PCBs and Related Interconnects at Frequencies up to 50 Ghz
Ballroom G
Tuesday, January 31
4:45 pm — 6:00 pm

Abstract:
The IEEE P370 group is creating a proposed standard on best practices using de-embedding techniques to extract measurements of circuit board based interconnect structures to 50 GHz. The group is composed of industry and academia experts from around the world. Specific task groups are evaluating fixture design practices, verification of de-embedding algorithms and methods and quality metrics for the extracted S-parameter models. An overview and the latest status of the draft will be presented in this panel briefing.

Panel Speakers:
Dr. Eric Bogatin — Dean, Signal Integrity Academy, Teledyne LeCroy
Xiaoning Ye — Senior Member of Technical Staff, Intel
Kai Xiao — Senior Member of Technical Staff, Intel
Jun Fan — Professor, MST
Mikheil Tsiklauri — Professor, MST
Heidi Barnes — Senior Application Engineer, Keysight Technologies
Jason Ellison — Signal Integrity Engineer, The Siemon Company

Back to Basics: The Onset of Skin Effect in Circuit Board Traces
Ballroom D
Wednesday, February 1
10:00 am — 10:45 am

Abstract:
The series resistance of signal and return paths in circuit board transmission line traces changes with frequency due to what is commonly referred to as the skin effect. This behavior dominates the conductor losses in interconnects above 5 Gbps. In this paper we introduce a new technique to measure the frequency dependent resistance and loop inductance of circuit board traces and compare the measurements to predictions from a popular 3D full wave solver.

Panel Speakers:
Dr. Eric Bogatin — Dean, Teledyne LeCroy Signal Integrity Academy
Yuriy Shlepnev — Simberian Inc
Tim Wang Lee — Ph.D Candidate, University of Colorado

A New Characterization Technique for Glass Weave Skew (Part 2)
Ballroom C
Wednesday, February 1
11:00 am — 11:45 am

Abstract:
At DesignCon2016, we presented a new methodology for characterizing glass weave skew sensitivity in circuit boards using the combination of a specially designed test pattern, a readily-available probing strategy, and instrumentation with sub-psec sensitivity and stability, earning a Best Paper Award for the Test and Measurement track. We will review the details of this method, including recent refinements that produce a statistically significant figure of merit, applying the technique to a wide variety of E-glass styles and low-Dk glass styles, summarizing the results with cost/performance tradeoffs.

Panel Speakers:
Dr. Eric Bogatin — Adjunct Professor, University of Colorado
Bill Hargin — Director of Technical Marketing, Nanya Plastics

Engineer of the Year Panel Discussion
Chiphead Theater
Thursday, February 2
3:00 pm — 3:45 pm

Abstract:
UBM Advanced Manufacturing Content Director and Design News Editor in Chief Suzanne Deffree moderates a far-reaching panel discussion among our yet-to-be-announced and previous two Engineers of the Year (EoY). 2016 EoY and signal-integrity evangelist Dr. Eric Bogatin and 2015 EoY and high-speed electronic circuit design expert Dr. Michael Steinberger will take the stage along with the newly-minted 2017 DesignCon EoY to discuss the important issues facing design engineers today.

Panel Speakers:
Dr. Eric Bogatin — Adjunct Professor, University of Colorado
Michael Steinberger — Lead Architect, Serial Channel Products, Signal Integrity Software, Inc
Suzanne Deffree — Content Director / Editor in Chief, UBM

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