DFA Quiz

by | Oct 27, 2017 | 5 comments

Design For Assembly is an essential part of the PCB design and manufacturing process. Yet, many PCB designers still make mistakes that cause delays and sometimes extra costs. Do you know everything about DFA? Take our quiz and find out!

 

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#1. What is the leading show-stopper in assembly?

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#2. Via-in-pads must be filled

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#3. What happens if one pad is substantially larger than its mate for a component?

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#4. What do you have to do if any component requires lead-free assembly?

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#5. How can you achieve the best possible thermal distribution during solder reflow?

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#6. Where can you format the manufacturer’s name, the item number, and the reference designators?

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#7. What does a design in ODB++ capture?

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5 Comments

  1. Tuan Tran

    #2- I disagree with the answer. When you have vias in a thermal pad, they should also be filled. If you leave the vias open, you can have solder wicked into the hole and go thru the other side during assembly.

    #5- The question does not make sense. What are you really asking???

    Reply
    • Yadav Venugopal

      Hi Tuan,

      Thank you for your input. We have changed the questions and options accordingly.

      Reply
  2. Christian

    Tua Tran…. you are wrong… VIP refers to VIA in pad… indicating that there is a n SMT component sitting atop that VIA. There is no question of solder wicking through as an SMT pad sits over it.. not a through hole pad… SMT pad. Either way the solder wicks only if the via hole is big enough. Instead what happens is solder does not wick through; but the air trapped between the solder and SMT pad on which the component is out gasses. Using VIPPO prevents this.

    For the condition you are talking about, typically bigger VIAs are required. On a bigger VIA you are unlikely to have just one big pad; or rather a big pad would use many small VIAs rather than one big VIA hole.

    To the protoExpress folks, is the 1st item the right answer to Q7? Why would I not have repeat REFDES for 4 boards being assembled? Would they not have to be identical REFDES for all boards. The only possible exclusion is if the boards are 4 different types of boards. Perhaps I do not understand the question!

    Reply
    • Yadav Venugopal

      Hi Christian,

      Thank you for correcting us. We have replaced question 7.

      Reply
  3. Kannan E

    #5. Component placement is based on the design requirement depends so many factors. Thermal distribution is just one of the factor. We will not be doing the placement based on the size of the component. The circuit and cabinet cabinet design dictates the component placement

    Reply

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