This NASA case study was originally published in Tech Briefs. It was written by Joshua Forgione, Electronics Engineer, NASA Ames Research Center. Carl Sorenson, Sensor Engineer, NASA Dryden Flight Research Center also contributed to this article.
When customers want to design HDI boards that are as compact as possible, there is often very little reliable guidance from the chip vendors. Heed the warnings of Texas Instruments: Consult board manufacturers from the start of any projects involving BGAs with a pin pitch of 0.4 mm and smaller.
SIGN UP FOR NEW ARTICLES AND UPDATES