ISRO (Indian Space Research Organization) has successfully launched Chandrayaan-2 on 22nd July at 21:21 UTC, which is their second lunar exploration mission after Chandrayaan-1. With billions of hearts beating, ISRO takes a major leap in its dream to place a rover on the moon.
We are witnessing intensified race among various space agencies for supremacy over the skies since the past few years. As per reports by the United Nations Office for Outer Space Affairs (UNOOSA), more than 4,500 artificial satellites are orbiting the earth with an increase of 4.87% compared to the previous years. Additionally, the increasing interest for flexible PCBs in satellite applications is attributed to the longer lifecycle and the increased flexibility. The viability of a flex PCBs for satellite applications is dependent on capability PCB design to operate without fault anywhere up to 10 years.
Composite amplifiers are part of electronic circuit board designs for a long time, particularly in applications involving audio devices. However, there is a growing importance to revisit and reinvent the good and the bad of composite amplifiers. Diversified features of composite amplifiers are the major reasons for their increasing popularity, which are critical in various electronic circuitries. Several manufacturers are making serious efforts in widening the scope of composite amplifiers. The key features of these new age composite amplifiers include superior performance levels and higher flexibility. Let us get familiar with the term composite amplifiers. Continue reading “Composite Amplifiers: The Good and The Bad”
The development of Isola Astra MT77 laminate and prepreg materials has garnered several eye-balls, particularly among PCB manufacturers. These materials will find applications in several mm-Wave systems. Astra MT77 is a low loss FR-4 process compatible laminate and prepreg. Isola Astra MT77 offers exceptional physical properties including broad operational frequency and higher temperature range. These laminates are highly preferred for commercial RF/microwave printed circuit designs and mm-Wave applications.
High-Density Interconnection or HDI substrates are multi-layer, high-density circuits with features including the fine line and well-defined space patterns. Increasing adoption of HDI substrates enhances the overall functionality of PCBs and limit the operational area. Continue reading “How to Avoid Crosstalk in HDI Substrate?”
Yes, It may Ruin Your PCB In-house Party.
Traces within the PCB are used to connect various components to various connectors. These traces can be identified as continuous paths of copper that exist on the surface of a circuit board. The trace width becomes crucial as it directly impacts on the working of the PCB. Additionally, increasing electricity flowing through PCB traces produces an immense amount of heat. Monitoring trace widths also helps minimize the heat build-up that typically occurs on boards. The conductor width also determines the resistance of the traces that directly affect the electricity flow.