HDI PCB Market for Semiconductors

Located in Silicon Valley, Sierra Circuits offers complete services to the local Semiconductor Industry giants, such as Marvell, Maxim and National Semiconductor. From PCB schematic to circuit board design, PCB fabrication and PCB assembly, we provide expertise, technology and excellent customer service. Services include turnkey PCB prototypes for evaluation boards and demo boards. Our high-end technology includes microelectronics and fine-line printed circuit build-up substrates used in flip chip or wire bond applications. Our latest technology includes PCB substrate with .25 mm pitch, achieved using build-up technology.

Our Capabilities include BT material from Mitsubishi and Panasonic, buried resistive and capacitive materials from Tycer and Ohmega, and non-glass reinforced materials. These materials are used in build-up, sequential lamination technology with fine lines down to 1.25 mils trace and space and solder mask defined pads.

LAYERS: 8 layers
MATERIAL: FR4-Lead Free
FINISH THICKNESS: 64 mils
TRACE/SPACE: Outer: Trace: 5mils Space: 3.53mils
Inner: Trace: 3mils Space: 3.56mils
NUMBER OF LAMINATIONS: 2 laminations
SURFACE FINISH: Immersion Gold
MINIMUM HOLE SIZE: 6 mils
PITCH: 0.4 mm
HDI stackup planning tool helps in creating a robust PCB design with great manufacturability and operational characteristics HDI PCB cross-sectional geometries explain the details of the dielectric PCB substrates, traces and reference planes within a PCB stack-up.

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