HDI PCB Market for Aerospace

Sierra Circuits understands the requirements for printed circuit board manufacturing in the Aerospace industry. We are currently working towards our AS9100 certification. The materials and process we use virtually eliminate any outgassing. Our High Density Interconnect PCB capability serves as a tool for reducing design size, weight and power consumption for the printed circuit board. Our culture of high mix of product on a quick schedule, coupled with our quality and reliability standards is a winning combination for the Aerospace industry.

PCB Capabilities include metal core boards for heat dissipation, high reliability process technology for vibration resistance.

LAYERS: 10 layers
MATERIAL: FR4
FINISH THICKNESS: 60 mils
TRACE/SPACE: Outer: Trace: 3.9mils Space: 3.9mils
Inner: Trace: 3.9 mils Space: 3.9mils
NUMBER OF LAMINATIONS: 4 laminations
SURFACE FINISH: Soft Bondable Gold
MINIMUM HOLE SIZE: 8 mils
PITCH: None
HDI stackup planning tool helps in creating a robust PCB design with great manufacturability and operational characteristics HDI PCB cross-sectional geometries explain the details of the dielectric PCB substrates, traces and reference planes within a PCB stack-up.

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