| OVERALL BOARD FEATURES |
| LAYER COUNT |
UP TO 12 |
| THICKNESS MINIMUM |
.025" |
| THICKNESS MAXIMUM |
.200" |
| THICKNESS TOLERANCE |
+/- 10% |
| BOW AND TWIST TOLERANCE |
7% |
| MAXIMUM BOARD SIZE(s) |
Up to 10" X 16" (on a 12" X 18" panel; this panel size is commonly used)
Up to 16" X 22" (on a 18" X 24" panel; this panel size is commonly used)
Up to 19" X 27" (on a 21" X 29" panel; this panel size is not as common) |
| MATERIALS AND DIELECTRICS |
| MATERIALS |
FR-4 FAMILY |
| |
POLYIMIDE |
| |
GETEK |
| |
THERMOUNT FAMILY |
| |
ROGERS 3000 SERIES |
| |
ROGERS 4000 SERIES |
| |
|
| BONDING SHEETS - PRE-PREG |
TO MATCH CORE MATERIAL |
| |
HYBRID CONSTRUCTIONS |
| INNER LAYER THICKNESS MINIMUM |
.005" |
| DIELECTRIC MINIMUM |
.003" |
| OUTER COPPER THICKNESS - MIN (BASE) |
.0007" (1/2 OZ) |
| INNER LAYER COPPER THICKNESS - MAX |
.0028" (2 OZ) |
| OUTER COPPER THICKNESS - MIN (BASE) |
.0007" (1/2 OZ) |
| OUTER COPPER THICKNESS - MAX (BASE) |
|
| HOLES |
| SMALLEST MECHANICALLY DRILLED HOLE |
.010" |
| SMALLEST LASER HOLE |
.006" |
| PLATING - SPECIAL HOLES - MIN |
.0008" |
| MAXIMUM PLATING IN HOLES |
.001" - .002" |
| PLATED HOLE TOLERANCE - DIAMETER |
.004" |
| PLATING ASPECT RATIO - MAXIMUM |
10:1 |
| HOLE PREP TYPE |
PERMANGANATE |
| |
PLASMA |
| LINE AND SPACE |
| INNER LAYER LINE WIDTH MINIMUM |
.005" |
| INNER TRACE WIDTH TOLERANCE |
+/- .001" |
| OUTER LAYER LINE WIDTH MINIMUM |
.005" |
| OUTER LAYER SPACE MINIMUM |
.005" |
| OUTER TRACE WIDTH TOLERANCE |
+/- .001" |
| PADS |
| PAD SIZE OVER HOLE DIAMETER |
.015" |
| SOLDERMASK |
| TYPE |
LPI - MOST COLORS |
| |
THERMAL CURE |
| PAD CLEARANCE MINIMUM |
.006" |
| MINIMUM LINE WIDTH - MASK |
.005" |
| REGISTRATION TOLERANCE |
.004" |
| FINAL FINISH |
| HOT AIR LEVEL |
.0005" -.0015" |
| HARD GOLD |
30-50 MICROINCHES |
| SELECTIVE GOLD |
30-50 MICROINCHES |
| SOFT BONDABLE GOLD |
20-40 MICROINCHES |
| FULL BODY GOLD |
20-40 MICROINCHES |
| ELECTROLESS NICKEL |
100-200 MICROINCHES |
| IMMERSION GOLD |
3-5 MICROINCHES |
| IMMERSION TIN |
|
| TIN/NICKEL |
100-300 MICROINCHES |
| IMMERSION SILVER |
3-4 MICROINCHES |
| LEGEND |
| TYPE |
MOST COLORS |
| CHARACTER LINE WIDTH MINIMUM |
.007" |
| FINAL FABRICATION |
| |
V-GROOVE ARRAY |
| |
ROUTED PIECE |
| COUNTERSINK |
MOST COLORS |
| |
COUNTERBORE |
| |
EDGE BEVEL |
| |
EDGE-MILL |
| MINIMUM INSIDE RADIUS |
.015" |
| ELECTRICAL TEST |
| TYPE |
CLAM-SHELL |
| |
FLYING PROBE |
| |
TDR |
| TEST SPECIFICATION |
IPC CLASS I, II, III |
| REPORTS AVAILABLE ON REQUEST |
| TYPE |
MICROSECTION |
| |
SOLDERABILITY |
| |
X-RAY FLUORESCENCE |
| |
IONIC CONTAMINATION |
| CONTROLLED IMPEDANCE |
| TESTING |
TDR |
| TYPE |
SINGLE END |
| |
DIFFERENTIAL |
| METAL CORE |
| TYPE |
ALUMINUM |
| BLIND VIA PROCESSING |
| TYPE |
SEQUENTIAL LAM |
| SMALLEST HOLE |
.006" |
| SILVER OR EPOXY FILL |
AVAIL SEQ LAM |
| MICRO VIA PROCESSING |
| SMALLEST HOLE |
.010" |
| SILVER OR EPOXY FILL |
.010" |
| MICRO VIA PROCESSING |
|
| SMALLEST HOLE |
.006" |
| CAPTURE PAD OVER HOLE SIZE - MIN |
.012" |
| PLATING ASPECT RATIO |
.5:1 |
| DIELECTRIC - MICROVIA LAYER |
.002" (+/- .0005) |
| MATERIALS - MICROVIA LAYER |
RESIN COATED FOIL |
| |
NON-WOVEN ARAMID |
| PCB SPECIFICATIONS |
| IPC CLASS |
IPC-A-600 CLASS I, II, III |
| MILITARY |
ROUTED PIECE |
LEAD TIMES |
| |
24 HOUR - QUICK TURN |
| |
24 HOUR - QUICK TURN |
| |
72 HOUR - QUICK TURN |
| |
MEDIUM VOLUME |
| |
HIGH VOLUME |
| |
|
