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Standard Technology PCBs

FEATURE STANDARD TECHNOLOGY
OVERALL BOARD FEATURES
LAYER COUNT UP TO 12
THICKNESS MINIMUM .025"
THICKNESS MAXIMUM .200"
THICKNESS TOLERANCE +/- 10%
BOW AND TWIST TOLERANCE 7%
MAXIMUM PCB Panel SIZE(s) Up to 10" X 16" (on a 12" X 18" panel; this panel size is commonly used)
Up to 16" X 22" (on a 18" X 24" panel; this panel size is commonly used)
Up to 19" X 27" (on a 21" X 29" panel; this panel size is not as common)
MATERIALS AND DIELECTRICS
MATERIALS FR-4 FAMILY
  POLYIMIDE
  GETEK
  THERMOUNT FAMILY
  ROGERS 3000 SERIES
  ROGERS 4000 SERIES
   
BONDING SHEETS - PRE-PREG TO MATCH CORE MATERIAL
  HYBRID CONSTRUCTIONS
INNER LAYER THICKNESS MINIMUM .005"
DIELECTRIC MINIMUM .003"
OUTER COPPER THICKNESS - MIN (BASE) .0007" (1/2 OZ)
INNER LAYER COPPER THICKNESS - MAX .0028" (2 OZ)
OUTER COPPER THICKNESS - MIN (BASE) .0007" (1/2 OZ)
OUTER COPPER THICKNESS - MAX (BASE)  
HOLES
SMALLEST MECHANICALLY DRILLED HOLE .010"
SMALLEST LASER HOLE .006"
PLATING - SPECIAL HOLES - MIN .0008"
MAXIMUM PLATING IN HOLES .001" - .002"
PLATED HOLE TOLERANCE - DIAMETER .004"
PLATING ASPECT RATIO - MAXIMUM 10:1
HOLE PREP TYPE PERMANGANATE
  PLASMA
LINE AND SPACE
INNER LAYER LINE WIDTH MINIMUM .005"
INNER TRACE WIDTH TOLERANCE +/- .001"
OUTER LAYER LINE WIDTH MINIMUM .005"
OUTER LAYER SPACE MINIMUM .005"
OUTER TRACE WIDTH TOLERANCE +/- .001"
PADS
PAD SIZE OVER HOLE DIAMETER .015"
SOLDERMASK
TYPE LPI - MOST COLORS
  THERMAL CURE
PAD CLEARANCE MINIMUM .006"
MINIMUM LINE WIDTH - MASK .005"
REGISTRATION TOLERANCE .004"
FINAL FINISH
HOT AIR LEVEL .0005" -.0015"
HARD GOLD 30-50 MICROINCHES
SELECTIVE GOLD 30-50 MICROINCHES
SOFT BONDABLE GOLD 20-40 MICROINCHES
FULL BODY GOLD 20-40 MICROINCHES
ELECTROLESS NICKEL 100-200 MICROINCHES
IMMERSION GOLD 3-5 MICROINCHES
IMMERSION TIN  
TIN/NICKEL 100-300 MICROINCHES
IMMERSION SILVER 3-4 MICROINCHES
LEGEND
TYPE MOST COLORS
CHARACTER LINE WIDTH MINIMUM .007"
FINAL FABRICATION
  V-GROOVE ARRAY
  ROUTED PIECE
COUNTERSINK MOST COLORS
  COUNTERBORE
  EDGE BEVEL
  EDGE-MILL
MINIMUM INSIDE RADIUS .015"
ELECTRICAL TEST
TYPE CLAM-SHELL
  FLYING PROBE
  TDR
TEST SPECIFICATION IPC CLASS I, II, III
REPORTS AVAILABLE ON REQUEST
TYPE MICROSECTION
  SOLDERABILITY
  X-RAY FLUORESCENCE
  IONIC CONTAMINATION
CONTROLLED IMPEDANCE
TESTING TDR
TYPE SINGLE END
  DIFFERENTIAL
METAL CORE
TYPE ALUMINUM
BLIND VIA PROCESSING
TYPE SEQUENTIAL LAM
SMALLEST HOLE .006"
SILVER OR EPOXY FILL AVAIL SEQ LAM
MICRO VIA PROCESSING
SMALLEST HOLE .010"
SILVER OR EPOXY FILL .010"
MICRO VIA PROCESSING  
SMALLEST HOLE .006"
CAPTURE PAD OVER HOLE SIZE - MIN .012"
PLATING ASPECT RATIO .5:1
DIELECTRIC - MICROVIA LAYER .002" (+/- .0005)
MATERIALS - MICROVIA LAYER RESIN COATED FOIL
  NON-WOVEN ARAMID
PCB SPECIFICATIONS
IPC CLASS IPC-A-600 CLASS I, II, III
MILITARY ROUTED PIECE
LEAD TIMES
  24 HOUR - QUICK TURN
  24 HOUR - QUICK TURN
  72 HOUR - QUICK TURN
  MEDIUM VOLUME
  HIGH VOLUME

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