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(Capabilities include the following, but are not limited to it. Call us for your special needs!)
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|
Materials
|
FR4
and Polyimide |
| Special
Requirements |
- Copper and Aluminum Metal Core
- Impedance Controlled Boards
- Milling
- Blind vias
- Buried vias
- Filled vias
- Plasma etchback
|
| Pitch |
Min .5 mm |
| SMT and Through Hole |
|
|
Imaging |
|
|
Min Line/Space |
.003"/.003" |
|
Surface Mt Pad |
.008" min |
|
Layer to Layer Reg |
+/- .002" |
| Lamination |
|
|
Max Layers |
20 |
|
Min Dielectric |
.0035" |
|
Max Thickness |
.250" |
|
Overall Thickness |
+/- 10% |
|
Bow & Twist W/SMD |
.75% |
|
Bow & Twist WO/SMD |
1.5% |
| Drill and
Routing |
|
|
Hole Location |
.004" |
|
Tolerance (PTH) |
+/- .003" |
|
Tolerance (NPTH) |
+/- .001" |
|
Min Drill Size |
.006" |
|
Aspect Ratio |
16:1 |
|
Min Pad |
FHS + .014" |
|
Min Plane Relief |
FHS + .025" |
| Plating |
|
|
Electroless Nickel |
100 u Min, 150 u Max |
|
Immersion Gold |
3 u - 8 u |
|
Nickel (electroplated) |
.0003" - .0005" |
|
Max Gold (electroplated) |
100 u |
|
Solder |
coverage and solderable |
| Etch
Factors |
|
|
Inner Layer |
+ .0005" |
|
Outer Layer |
+ .0005" |
|
Controlled Impedance |
+ 10% (Tighter tolerances down to 5% may be allowed on a per job basis with
additional charges)
|
| Solder
Mask |
|
|
Min Clearance |
.002" /side |
|
Min Lay Down |
.004" |
|
Color |
Clear, Black, Red, Blue, White, Purple, etc. |
| Nomenclature |
|
|
Min Line |
.005" |
|
Color |
White, Black, Yellow, etc. |
