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UL Approved |
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Improves thermal cycling reliability by a factor of 4 times or more |
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Improves assembly solder cycle reliability 3-4 times or more |
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Tg is not an important effect with HI.E.R. as the
copper via is now stronger then the laminate expansion |
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Does not effect any parameters such as
dielectric rating, CAF ability, impedance or fine lines |
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Extends lower temperature usability to -173 ° C
or lower |
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Extends upper usable temperature a significant
amount above Tg |
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Does not effect UL or military rating. |
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Significantly improves RAD ratings in nuclear
hardening |
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Has been extensively tested by Sierra engineering staff as well as certified independent laboratories to significantly improve reliability |