Since 1986, Sierra Circuits, has been a leading supplier of high technology, quick-turn Printed Circuit Boards. ISO-9001:2000 and MilSpec certified, Silicon Valley based company.
From standard technology online PCBs to 22 layer, blind/buried vias, metal core PCBs, we are:
America's Complete PCB Resource
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Sierra Circuits Manufacturing Capabilities
We produce PCBs using state-of-the-art machines for processes such as Direct Imaging, Laser Drilling, Reverse Pulse Plating and Flying-Probe net-list testing. Other examples of machines are: Camtek/Pentax Laser Direct Imaging (LDI), Printar automated screen legending (www.printar.com).
Our premier plant is the high technology, 46,000 sq. ft., ISO 9001:2000 and Milspec certified facility in Sunnyvale, California.
Since 1986, we have continuously re-invested in our capabilities and training to manufacture the best PCB's possible. So whether it is etching, drilling, engineers or technical advisors, our technology and our people are state of the art. And that's why customers have rated our manufacturing process as one of the best in the PCB industry for over twenty years.
In 2007, we acquired PC Boards, Inc. based in Kansas. This 64,000 sq.ft. manufacturing plant (also ISO 9001:2000 and Milspec Mil-PRF 55110 certified) is spread on 8.5 acres and provides us immense capacity and growth potential. This facility has been renamed to Sierra Midwest (www.sierramidwest.com)
Browse our Capabilities online, download our brochure, or give us a call to find out what really makes us cutting-edge.
See our Equipment List here.
See some pictures from our Sunnyvale facility here.
See our PCB Assembly capability here.

Ask a question/send feedback
Download a brochure about our capabilities
Download a presentation on MicroElectronics
CAPABILITY LIST FOR SIERRA CIRCUITS
Product Features Standard Advanced Micro Electronics
Board Attributes
Min Layer count 1 1 1
Max Layer Count2426+14
Min Board Thickness.010".004".002"
Max Board Thickness.200".200" +.200"
Min Core Thickness.002".002".002"
Min Dielectric.002".0015".001"
Min. Starting Copper Foil Weight9 micron< 5 micron1 micron
Max. Finished Copper Thickness (O/L)6 oz> 6 oz.0015"
Max. Finished Copper Thickness (I/L)4 oz> 4 oz.001"
Maximum Panel Size21" x 29"21" x 29"12" x 18"
Minimum Panel Size12" x 18"12" x 18"8" x 8"
Smallest Mech Drill Diameter.0059".004".004"
Smallest Laser Drill Diameter.006".004".002"
Min Finished Hole Size.004".002"Plated shut
Max Thru Hole Aspect Ratio16:01>16:116:01
Max Blind Via Aspect Ratio.75:11.2:1.8:1
Blind Via Finished Hole Size.004"Plated shutPlated shut
Buried Via Finished Hole Size.004".002".002"
Min LW/LS (mils).003".002".00125"
Min Pad Size for test.005".003".001"
Process Pad DiameterD + .012" (1 mil annular ring)D + .010" (Tangency)D + .006"
Stacked viasYesYesYes
Minimum Wire Bond Pad size> .006".004 - .0059"<.004"
Controlled Impedance Tolerance10%5%10%
Solder Mask Registration.002"<.002".002"
Solder Mask Feature Tolerance.001".001".001"
Solder Mask Min Dam Size.004".002".002"
Min. Diameter Rout Cutter Available.024".021".020"
Routed Part Size Tolerance.010"<.010"<.010"
Laser hole location Tolerance.0005".0005".0005"
Laser Routed Part Size Tolerance - can only be done with panels <.032" thick.001".001".001"
Bow & Twist Tolerance7%<7%<7%
Thickness Tolerance10%< 10%< 10%
 
Sequential Lam2 or less lam cycles> 3 lam cycles> 3 lam cycles
Buried Vias2 or less> 3> 3
Blind ViasYesYesYes
Conductive Filled ViasYesYesYes - Cu plate shut
Non Conductive Filled ViasYesYesYes
Surface Finishes
HASL (Vertical or Horizontal)YesYesNo
Lead Free HASLYesYesNo
OSP (Shikoku F2)YesYesYes
OSP (Entek)YesYesYes
ENIGYesYesYes
Immersion SilverYesYesYes
Immersion White TinYesYesYes
Tin NickelYesYesNo
Electrolytic Soft GoldYesYesYes
Electrolytic Hard GoldYesYesYes
Selective GoldYesYesYes
Solder Masks
Semi - Gloss GreenYesYesYes
Gloss GreenYesYesYes
Matte - GreenYesYesYes
BlackYesYesYes
RedYesYesYes
BlueYesYesYes
YellowYesYesYes
Legend
All colorsYesYesYes
Fab
Routed ArrayYesYesYes
V ScoreYesYesYes
CountersinkYesYesYes
CounterboreYesYesYes
BevelYesYesYes
MillingYesYesYes
Edge CastellationYesYesYes
Edge PlatingYesYesYes
HeatsinksYesYesNo
Electrical Test
10 VoltYesYesYes
40 Volt (Burn in bds)YesYesYes
250 VoltNoYesYes
500 VoltNoYesYes
Hi PotNoYesNo
Laminate Materials
Very Thin FilmNoYesYes
Arlon 85NTYesYesNo
Hybrid ConstructionsYesYesYes
Isola FR406YesYesYes
Isola FR408YesYesYes
Isola IS410YesYesYes
Isola IS620NoYesNo
Isola P95YesYesYes
Isola P96YesYesYes
Matsushita R1766YesYesYes
Matsushita R1755YesYesNo
Matsushita MegtronYesYesNo
Nelco N4000-13 (SI)YesYesYes
Nelco N4000-6 FCYesYesYes
Nelco N4000-29YesYesNo
Neltec N7000-2YesYesYes
No Flow Pre PregYesYesYes
Polyclad PCL370HRYesYesYes
Polyclad GetekYesYesYes
PSA Bond FilmNoYesYes
Rogers 3000YesYesNo
Rogers R4003YesYesNo
Rogers R4350YesYesNo
Rogers 5880YesYesNo
Rogers 6000YesYesNo
Rogers TMMYesYesNo
Available Reports
MicrosectionYesYesYes
SolderabilityYesYesYes
X-ray FluorescenceYesYesYes
Ionic ContaminationYesYesYes
Time Domain Reflectometry test (TDR)YesYesYes
FAIYesYesYes
Certificate of Compliance (C of C)YesYesYes
UL
94VOYesYesNo
PCB Classifications
Military 55110YesYesNo
IPC 6012, Class 1, 2 & 3YesYesYes
ISO 9001:2000YesYesYes
Capabilities By Market:
 
1.High Reliability Boards
  -Up to 2000 Thermal cycles
  -For Boards that must not fail
 
2.Burn-in Boards
  -14 Layers - .062" thick
  -.5 mm pitch
  -Step-down connectors
  -Special materials
  -Large sizes up to 24" x 28"
  -High Reliability
 
3.High Technology Boards
  -Microelectronics (Line and Space down to .00125"/.00125")
[learn more]
  -Differential Impedance
  -Up to 30 Layers
  -Lead Free process
  -Special materials
  -Sequential lamination
  -Blind and buried vias
  -Laser Drill
  -Filled vias
  -Via in pads
  -Milspec
  -Metal core
  -Carbon paste
  -Plated edges
  -Plated edge holes
  -Milling
  -Heavy Copper
  -Selective Finishes
 
4.Standard Technology Boards
  -1 to 10 Layers
  -Trace/Space 5/5
  -Same day for 2 Layers
  -24 hours to 10 Days for multilayers
  -Lead Free process
  -All standard materials
Capabilities By Process:
Front-end CAM
 -Fully automated Tooling System
 
Imaging-Laser Direct Imaging
 -Trace/Space 2/2
 
Multilayer Lamination
 -Up to 30 Layers
 -Sequential lamination
 -Automated registration
 
Drilling
 -.006" Mechanical Drill
 -Laser Drill down to 2 mils (.002")
 
Etching
 -Trace/Space 2/2 mils
 
Plating
 -Aspect ratio 10+
 
Soldermask
 -LPI, Dry Film
 
Silkscreen
 -Automated
 -5 mil lines
 
Fabrication
 -Route and retain
 -Scoring
 
Electrical Test
 -.5mm pitch, Flying probe and High Density grid
 
Quality and Production Control Information System
 -Pro-CIM
 
Materials
 -Lead Free FR-4
 -Polyimides
 -Rogers 4003 & 4350
 -Teflons
 -Ceramics
 -Most other materials
See our Equipment List here.
See some pictures from our Sunnyvale facility here.

To find out more about our capabilities, call 800-763-7503 ext. 500 and ask for Amit.







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